10AX066N3F40I2LG

The Intel Arria 10 GX 10AX066N3F40I2LG is a field-programmable gate array (FPGA) device from the Arria 10 family, implemented on a 20 nm-class architecture. It delivers a high-density logic fabric and on-chip memory combined with advanced I/O and transceiver capabilities targeted at mid-range, performance-sensitive applications across wireless, wireline, broadcast, computing, medical, and defense markets.

This device balances performance and power efficiency while providing industrial-grade operating range and a compact 1517-FCBGA (40×40) package for surface-mount assembly, making it suitable for demanding embedded and communications systems.

Key Features

• Logic Capacity — 660,000 logic elements, providing substantial programmable logic resources for complex designs.
• Embedded Memory — 49,610,752 total RAM bits to support large on-chip buffering, caches, and packet/frame storage.
• I/O and Packaging — 588 I/O pins in a 1517-BBGA / 1517-FCBGA (40×40) package; surface-mount package for board-level integration.
• Power Supply — Core voltage range from 870 mV to 930 mV for the device core supply.
• Thermal and Grade — Industrial-grade device rated for operation from −40 °C to 100 °C.
• RoHS Compliance — Meets RoHS environmental requirements.
• Family-Level Architecture — Arria 10 family features described in the device documentation include variable-precision DSP blocks, embedded memory blocks, advanced clock networks and PLLs, low-power serial transceivers, and integrated hard IP for PCIe Gen1/Gen2/Gen3 and high-speed Ethernet applications.

Typical Applications

• Wireless Infrastructure — Channel and switch cards or mobile backhaul equipment leveraging high logic density and on-chip memory for signal processing and packet handling.
• Wireline Networking — Line cards, muxponders, and transponder modules that require high-speed serial transceivers and integrated protocol hard IP such as PCIe and Ethernet.
• Broadcast and Professional AV — Studio switches, video processing and transport applications that use large embedded RAM and abundant I/O for frame buffering and real-time processing.
• Compute Acceleration and Storage — Server acceleration, flash cache controllers and cloud compute offload where programmable logic and DSP resources are used to implement custom data-paths.
• Medical and Defense — Diagnostic imaging, radar, and electronic warfare subsystems that require industrial temperature operation and high-performance FPGA resources.

Unique Advantages

• High Logic Density: 660,000 logic elements enable complex system integration into a single device, reducing board-level component count.
• Large On-Chip Memory: Nearly 50 Mb of RAM bits supports extensive buffering and on-chip data management to minimize external memory dependence.
• Comprehensive I/O and Package: 588 I/Os in a 1517-FCBGA (40×40) surface-mount package offers a balance of connectivity and compact board footprint.
• Industrial Temperature Range: Rated −40 °C to 100 °C for deployment in temperature-challenging environments.
• Power-Efficient Core: Core supply specified between 870–930 mV to support low-voltage operation and power-sensitive designs.
• Arria 10 Ecosystem: Family-level features and Intel device documentation provide design references for DSP blocks, transceivers, PLLs, and hard IP to accelerate development.

Why Choose 10AX066N3F40I2LG?

The 10AX066N3F40I2LG combines a high logic element count, substantial on-chip memory, and abundant I/O in an industrial-grade, surface-mount FCBGA package. It is positioned for mid-range applications that require a blend of performance, power efficiency, and integration—such as communications line cards, video processing, compute acceleration, and measurement systems.

Engineers selecting this device benefit from Arria 10 family features documented for advanced clocking, DSP, transceiver, and hard IP capabilities, enabling scalable designs with robust on-chip resources and industrial temperature operation.

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