10AX066N3F40E2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 588 49610752 660000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,089 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 588 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 250540 | Number of Logic Elements/Cells | 660000 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49610752 |
Overview of 10AX066N3F40E2LG – Arria 10 GX FPGA IC, 660,000 logic elements, 1517-FCBGA
The 10AX066N3F40E2LG is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 1517-ball FCBGA package. It delivers a mid‑range, high‑performance programmable fabric designed for power‑sensitive applications where integration of logic, DSP, memory and high‑speed I/O is required.
Targeted markets include wireless infrastructure, high‑speed wireline systems, broadcast/video processing, data‑center acceleration and medical imaging. The device combines large logic capacity, substantial on‑chip RAM and a high I/O count to enable system consolidation and flexible hardware acceleration.
Key Features
- Core Architecture Arria 10 GX family device architecture optimized for mid‑range, high‑performance programmable logic as described in the Arria 10 device overview.
- Logic Capacity 660,000 logic elements provide substantial programmable resources for complex FPGA designs and hardware acceleration tasks.
- Embedded Memory 49,610,752 total RAM bits of on‑chip memory to support large buffering, caches and state storage without immediate external memory dependency.
- I/O and Integration 588 I/Os enable extensive external connectivity and system‑level integration for multi‑channel or high‑port designs.
- Package and Mounting 1517‑ball FCBGA (1517‑FCBGA, 40×40) package, surface‑mount for dense board integration and compact system footprints.
- Power Core voltage supply specified at 870 mV to 930 mV, enabling low‑voltage operation consistent with Arria 10 device power requirements.
- Thermal and Grade Extended grade with an operating temperature range of 0 °C to 100 °C for applications requiring wide ambient temperature tolerance.
- Compliance and Documentation RoHS‑compliant; detailed device documentation and an Arria 10 device handbook are available for design guidance and known‑issue tracking.
Typical Applications
- Wireless Infrastructure — Channel and switch cards, remote radio head modules and mobile backhaul equipment leveraging programmable logic for signal processing and control.
- High‑Speed Wireline — 40G/100G line cards, muxponders and transponder systems that require high logic density and extensive I/O for packet processing and aggregation.
- Broadcast and Pro AV — Studio switching, video processing and transport systems that benefit from on‑chip memory and flexible I/O routing.
- Data Center Acceleration — Server acceleration, flash cache and cloud computing offload applications using programmable DSP and logic resources.
- Medical Imaging — Diagnostic and imaging systems that require large buffering, deterministic processing and scalable logic resources.
Unique Advantages
- High logic density: 660,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing BOM and board complexity.
- Large on‑chip RAM: Nearly 50 million bits of embedded RAM support large frame buffers, line memory and cache structures without immediate external memory.
- Extensive I/O: 588 I/Os provide the connectivity needed for multi‑lane interfaces, multiple peripherals and high‑channel‑count designs.
- Compact, high‑pin package: 1517‑FCBGA (40×40) surface‑mount package supports dense system integration in space‑constrained designs.
- Low‑voltage core operation: 870–930 mV supply range supports power‑optimized designs that target reduced core power consumption.
- Extended temperature grade: 0 °C to 100 °C operating range addresses applications exposed to broad ambient conditions.
Why Choose 10AX066N3F40E2LG?
The 10AX066N3F40E2LG combines Arria 10 GX family architecture with substantial logic, memory and I/O resources to enable mid‑range, high‑performance designs that must balance throughput and power. Its package and pin count support system‑level consolidation while the extended temperature grade and RoHS compliance make it suitable for a broad set of commercial and industrial applications.
Designers who require a programmable, high‑capacity FPGA with extensive documentation and device‑family resources will find this device appropriate for accelerating processing tasks, integrating complex interfaces and reducing overall system complexity.
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