10AX066N2F40I2SG

The 10AX066N2F40I2SG is an Intel Arria 10 GX Field Programmable Gate Array supplied in a 1517‑FCBGA (40×40) package. It is part of the Arria 10 device family of 20 nm mid‑range FPGAs, designed for high‑performance, power‑sensitive applications across communications, broadcast, computing, medical and defense markets.

This device combines large logic capacity, extensive on‑chip memory and a high I/O count with an industrial operating range, making it suitable for demanding embedded and data‑plane designs that require density and deterministic environmental performance.

Key Features

• Core architecture  Part of the Intel Arria 10 device family (20 nm mid‑range FPGA architecture) intended for higher performance and improved power efficiency.
• Logic capacity  660,000 logic elements to implement complex control, signal processing and custom logic functions.
• On‑chip memory  49,610,752 total RAM bits of embedded memory for large buffering and local data storage.
• I/O and package  588 I/O pins in a 1517‑BBGA / 1517‑FCBGA (40×40) surface‑mount package for high‑density board integration.
• Power  Core voltage supply range 870 mV to 980 mV for the device core domain.
• Temperature and grade  Industrial grade operation from −40 °C to 100 °C for reliable performance in harsh environments.
• Mounting and compliance  Surface mount package; RoHS compliant.
• Architectural features (device family)  Arria 10 family features include variable‑precision DSP blocks, embedded memory blocks, clock networks and PLLs, PCIe hard IP and low‑power serial transceivers as described in the Arria 10 device documentation.

Typical Applications

• Wireless infrastructure  Channel and switch cards in remote radio heads and mobile backhaul where dense DSP and I/O are required.
• Wireline and optical networking  40G/100G muxponders, transponders and line cards benefiting from high logic capacity and on‑chip memory.
• Broadcast and professional AV  Studio switches, video transport and processing systems that need high‑density logic and deterministic operation.
• Computing and storage  Server acceleration, flash cache and cloud infrastructure applications leveraging large RAM capacity and logic density.
• Medical and defense systems  Diagnostic imaging, radar and secure communications where industrial temperature range and robust FPGA resources are required.

Unique Advantages

• High logic density: 660,000 logic elements support complex SoC‑class designs and advanced signal processing on a single device.
• Large embedded memory: Nearly 49.6 million bits of on‑chip RAM reduce external memory dependence and accelerate data‑intensive tasks.
• Extensive I/O count: 588 I/O pins provide flexibility for diverse interfaces and high‑pin‑count system integration.
• Industrial temperature range: Rated −40 °C to 100 °C to meet demanding environmental requirements without derating device capability.
• Compact, manufacturable package: 1517‑FCBGA (40×40) surface‑mount package supports dense PCB layouts and high‑volume assembly processes.
• Standards and family‑level features: Arria 10 family documentation describes DSP blocks, PLLs, PCIe hard IP and low‑power transceivers to support high‑speed communications and processing subsystems.

Why Choose 10AX066N2F40I2SG?

The 10AX066N2F40I2SG delivers a balanced combination of logic density, on‑chip memory and I/O capacity within the Intel Arria 10 GX family—addressing mid‑range designs that require strong performance with power efficiency and industrial reliability. Its specification set makes it suitable for communications, compute acceleration, broadcast and other embedded systems that demand sizable programmable resources and a wide operating temperature range.

Designs leveraging this device benefit from the Arria 10 family architecture and accompanying Intel device documentation for implementation guidance, enabling scalable, maintainable designs backed by published device resources.

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