10AX066N2F40I1HG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 588 49610752 660000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 236 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 588 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 250540 | Number of Logic Elements/Cells | 660000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49610752 |
Overview of 10AX066N2F40I1HG – Arria 10 GX FPGA, 660,000 logic elements, 1517-FBGA
The 10AX066N2F40I1HG is an Intel Arria 10 GX field-programmable gate array (FPGA) offered in a 1517-BBGA / 1517-FBGA (40×40) surface-mount package. It delivers a high-capacity, mid-range FPGA architecture designed for performance and power-sensitive applications.
With 660,000 logic elements, 49,610,752 total on-chip RAM bits and 588 I/O pins, this industrial-grade device targets wireless and wireline infrastructure, broadcast and professional AV, compute and storage acceleration, and other mid-range applications that require a balance of integration, connectivity and power efficiency.
Key Features
- Core Capacity 660,000 logic elements provide a large programmable fabric for complex mid-range digital designs.
- Embedded Memory 49,610,752 total RAM bits of on-chip memory to support buffering, packet processing and local data storage.
- I/O and Connectivity 588 user I/O pins enable high-density external interfacing and connectivity options.
- Package and Mounting 1517-BBGA, FCBGA (supplier package: 1517-FBGA 40×40) in a surface-mount form factor for compact, high-density board designs.
- Power Supply Supported core voltage range: 870 mV to 980 mV to match system power-rail requirements.
- Operating Range and Grade Industrial-grade device rated for operation from −40 °C to 100 °C.
- Family Architectural Features As part of the Intel Arria 10 family, the device benefits from the family’s 20 nm architecture focused on higher performance and power efficiency, and includes family-level capabilities such as embedded memory blocks, DSP blocks, clock networks and PLLs as described in the Arria 10 documentation.
- Regulatory Compliance RoHS compliant.
Typical Applications
- Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul systems that require programmable logic and I/O bandwidth.
- Wireline Networking 40G/100G muxponders, transponders and line cards where on-chip memory and rich I/O support packet processing and high-speed interfaces.
- Broadcast & Professional AV Studio switches, video transport and conferencing equipment benefiting from programmable signal routing and processing.
- Compute & Storage Acceleration Server acceleration, flash cache and cloud computing server functions that leverage large logic capacity and embedded memory.
- Medical & Defense Systems Diagnostic imaging, radar and guidance subsystems that need a balance of performance, integration and industrial temperature operation.
Unique Advantages
- High logic density: 660,000 logic elements enable implementation of complex algorithms and multi-function systems on a single device, reducing board-level integration.
- Substantial on-chip memory: Nearly 50 million RAM bits reduce reliance on external memory for buffering and data staging, improving throughput and latency.
- Dense external connectivity: 588 I/O pins support extensive peripheral and high-speed interface integration without external multiplexing.
- Industrial temperature rating: −40 °C to 100 °C operation ensures suitability for applications with extended ambient requirements.
- Compact, high-density package: 1517-FBGA (40×40) surface-mount package allows space-efficient board layouts for systems with tight form-factor constraints.
- Power-aware architecture: Part of the Arria 10 family designed for higher performance and power efficiency, with a defined core voltage range (870 mV–980 mV) to support system power optimization.
Why Choose 10AX066N2F40I1HG?
The 10AX066N2F40I1HG positions itself as a high-capacity, industrial-grade Arria 10 GX FPGA suited to mid-range applications that require a blend of logic density, on-chip memory and high I/O count. Its family-level architecture emphasizes performance and power efficiency while offering the programmable resources needed for diverse markets including wireless and wireline infrastructure, broadcast, compute acceleration and specialized medical or defense systems.
Choosing this device provides a scalable platform within the Arria 10 family, enabling designers to leverage the device’s logic and memory resources alongside documented Arria 10 features and development flows for sustained product development and system integration.
Request a quote or submit an inquiry to receive pricing, availability and lead-time information for the 10AX066N2F40I1HG.

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