10AX066N2F40E1SG

IC FPGA 588 I/O 1517FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 588 49610752 660000 1517-BBGA, FCBGA

Quantity 33 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O588Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs250540Number of Logic Elements/Cells660000
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49610752

Overview of 10AX066N2F40E1SG – Arria 10 GX FPGA (660,000 logic elements)

The 10AX066N2F40E1SG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) supplied in a 1517-FCBGA (40×40) package. As part of the Arria 10 device family, this device targets high-performance, power-efficient 20 nm mid-range FPGA applications across communications, broadcast, computing, medical, and defense markets.

With a large logic capacity and substantial embedded RAM, this FPGA is designed for midrange systems that require high integration density, significant on-chip memory, and broad I/O connectivity in a surface-mount package and extended-grade temperature range.

Key Features

  • Logic Capacity  660,000 logic elements provide high integration density for complex logic, control and data-path functions.
  • On-chip Memory  Total embedded RAM of 49,610,752 bits supports large buffering, packet processing, or algorithmic state storage without relying solely on external memory.
  • I/O Resources  588 general-purpose I/O pins enable extensive external connectivity for high-pin-count interfaces and multi-channel systems.
  • Series Architecture and IP  Arria 10 family features described in the device documentation include adaptive logic modules, variable-precision DSP blocks, embedded memory blocks, clock networks with PLLs, and hard IP blocks for PCIe Gen1/Gen2/Gen3 and high-speed Ethernet—capabilities intended to accelerate system-level design.
  • Power Supply Range  Core voltage supply range of 870 mV to 980 mV supports the device’s specified operating conditions.
  • Package & Mounting  1517-BBGA / 1517-FCBGA (40×40) package in a surface-mount form factor for compact board-level integration.
  • Operating Conditions & Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C to fit thermally controlled or commercial-environment systems.
  • Compliance  RoHS compliant.

Typical Applications

  • Wireless infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging high logic density and on-chip memory.
  • Wireline networking  40G/100G muxponders, transponders and line cards where on-chip logic, embedded memory and high I/O counts support packet processing and aggregation functions.
  • Broadcast and professional AV  Studio switches and video transport applications that require dense logic and plentiful I/O for multi-channel signal routing and processing.
  • Computing and storage  Server acceleration tasks, flash cache and cloud infrastructure functions where FPGA offload and large on-chip RAM improve throughput and latency.
  • Medical and defense systems  Diagnostic imaging, radar and electronic-warfare subsystems that benefit from programmable DSP capability, memory capacity and high integration.

Unique Advantages

  • High integration density: 660,000 logic elements reduce the need for external glue logic and allow complex SoC-style designs on a single FPGA.
  • Substantial on-chip RAM: Nearly 50 Mbits of embedded RAM enables larger buffering and stateful processing directly on-chip, simplifying board-level memory architectures.
  • Extensive I/O: 588 I/O pins support multi-lane interfaces and a wide range of external peripherals without immediate dependence on external expanders.
  • Series-level IP and resources: Arria 10 family documentation describes hard IP options (PCIe, Ethernet), DSP blocks and clocking resources that accelerate implementation of common high-performance functions.
  • Surface-mount 1517-FCBGA package: Compact 40×40 FCBGA simplifies board layout for high-density systems while providing a robust mechanical and thermal interface.
  • Extended temperature grade: Rated for 0 °C to 100 °C to match designs targeted at controlled or commercial environments requiring a wider-than-standard operating window.

Why Choose 10AX066N2F40E1SG?

The 10AX066N2F40E1SG Arria 10 GX FPGA combines a high logic count, large embedded RAM and a high I/O count in a compact 1517-FCBGA surface-mount package. It is positioned for midrange, performance-sensitive applications where integration density, on-chip memory and flexible connectivity reduce system complexity and BOM.

As a member of the Intel Arria 10 device family, this device is supported by family documentation and device-level resources that address FPGA architecture, memory, DSP, clocking and hard IP usage—helping engineering teams scale designs and manage development risk across communications, computing, broadcast, medical and defense applications.

Request a quote or submit an inquiry to receive pricing and availability information for 10AX066N2F40E1SG. Our team can provide lead-time details and help evaluate this FPGA for your specific system requirements.

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