10AX066N2F40E1HG

IC FPGA 588 I/O 1517FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 588 49610752 660000 1517-BBGA, FCBGA

Quantity 790 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O588Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs250540Number of Logic Elements/Cells660000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits49610752

Overview of 10AX066N2F40E1HG – Arria 10 GX Field Programmable Gate Array (FPGA)

The 10AX066N2F40E1HG is an Intel Arria 10 GX field programmable gate array supplied in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package and offered in Extended grade. This device integrates 660,000 logic elements and 49,610,752 bits of embedded RAM to support mid-range, high-performance programmable logic designs.

Built on the Arria 10 device family architecture, the part targets demanding applications that require high logic density, substantial on-chip memory, and a wide I/O count—while operating from a core supply of 870 mV to 980 mV and across a 0 °C to 100 °C operating temperature range.

Key Features

  • Logic Capacity  660,000 logic elements to implement complex, high-density logic and custom processing pipelines.
  • On‑Chip Memory  49,610,752 total RAM bits of embedded memory to support large buffers, packet processing, and user memory structures.
  • I/O Density  588 general-purpose I/O pins for broad interfacing options to external devices and subsystems.
  • Package & Mounting  1517-BBGA (supplier package 1517-FBGA, 40×40) in a surface-mount form factor for compact board integration.
  • Power Supply  Core voltage support from 870 mV to 980 mV to match system power rails and power-management schemes.
  • Operating Range & Grade  Extended-grade device rated for 0 °C to 100 °C operation.
  • Arria 10 Family Capabilities  Family-level features include adaptive logic modules, variable-precision DSP blocks, embedded memory blocks, clock networks with PLLs, PCIe Gen1/Gen2/Gen3 hard IP, low-power serial transceivers, and support for high-speed networking and memory interfaces.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards, remote radio heads, and mobile backhaul equipment that require programmable logic density and flexible I/O.
  • Telecommunications & Wireline  40G/100G muxponders, transponders, and line cards where embedded memory and hard IP for PCIe and high-speed serial links are beneficial.
  • Broadcast & Media  Studio switches, video transport, and professional audio/video processing leveraging on-chip RAM and high I/O counts for routing and buffering.
  • Computing & Storage  Server acceleration, flash cache, and cloud infrastructure applications that use programmable logic for offload and custom I/O processing.
  • Imaging & Diagnostic Systems  Medical diagnostic scanners and imaging equipment that need large on-chip memory and substantial logic resources for data acquisition and preprocessing.

Unique Advantages

  • High Logic Density:  660,000 logic elements enable implementation of large-scale, custom processing architectures without immediate need for external logic expansion.
  • Substantial On‑Chip Memory:  49,610,752 bits of embedded RAM reduce dependence on external memory for buffer-intensive designs and accelerate data-path operations.
  • Extensive I/O:  588 I/O pins provide flexibility to connect numerous peripherals, sensors, transceivers, and memory interfaces directly to the FPGA.
  • System-Level Feature Set:  Arria 10 family features such as DSP blocks, PLL-backed clocking, and serial transceiver support allow integration of signal processing, timing, and high-speed I/O in a single device.
  • Compact Package:  1517-BBGA, surface-mount packaging enables high-density PCB designs while supporting the device’s thermal and routing requirements.
  • Extended Grade:  Rated for 0 °C to 100 °C operation for applications requiring extended commercial temperature performance.

Why Choose 10AX066N2F40E1HG?

The 10AX066N2F40E1HG delivers a balance of high logic capacity, considerable embedded memory, and broad I/O in a compact surface-mount BBGA package—making it a strong fit for mid-range, performance-sensitive designs. Its alignment with Arria 10 family capabilities (DSP resources, PLLs, transceivers, and PCIe hard IP at the family level) provides system designers the building blocks needed to consolidate functions and simplify board-level architecture.

This device is suited to engineering teams developing wireless infrastructure, high-speed networking, broadcast/video processing, server acceleration, and imaging systems that require scalable programmable logic, on-chip memory, and flexible interfacing while operating within the specified voltage and temperature envelopes.

Request a quote or submit an inquiry to receive pricing and availability for the 10AX066N2F40E1HG and to discuss your design requirements.

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