10AX090H2F34E1SG

The 10AX090H2F34E1SG is an Intel Arria 10 GX field programmable gate array (FPGA) IC supplied in a 1152-ball FCBGA package. It combines high logic density and substantial embedded memory with a broad I/O count to address mid-range, performance-sensitive applications.

This device family is positioned for markets such as wireless and wireline communications, broadcast, computing and storage, medical imaging, and defense systems where performance, power efficiency, and flexible system integration matter.

Key Features

• Logic Capacity — 900,000 logic elements provide a foundation for complex digital designs and system-level integration.
• Embedded Memory — 59,234,304 total RAM bits on-chip to support large frame buffers, packet buffering, or DSP data storage.
• I/O and Interfaces — 504 device I/O pins support wide external connectivity and high-bandwidth interfacing.
• Transceivers and Hard IP — Series documentation highlights low-power serial transceivers and hard IP for PCIe Gen1/Gen2/Gen3, enhanced PCS for Interlaken and 10 Gbps Ethernet support, enabling high-speed serial link integration.
• DSP and Clocking — Variable-precision DSP blocks and comprehensive clock networks, including PLL clock sources and fractional synthesis, for flexible signal processing and timing architectures.
• Power and Voltage — Core voltage supply range from 870 mV to 980 mV to match targeted power-management strategies.
• Package & Mounting — 1152-BBGA / 1152-FCBGA (35x35) supplier device package in a surface-mount form factor for compact board-level integration.
• Operating Range & Grade — Extended grade with an operating temperature range of 0°C to 100°C to suit many commercial and industrial-adjacent deployments.
• Configuration & Reconfiguration — Device overview references support for dynamic and partial reconfiguration and enhanced configuration methods for flexible in-field updates.
• Standards & Compliance — RoHS compliant.

Typical Applications

• Wireless Infrastructure — Channel processing and mobile backhaul functions where a mix of DSP, memory, and I/O density is required.
• Wireline Transport — Line cards, muxponders, and transponders for 40G/100G systems using the device’s high-speed serial and PCS capabilities.
• Broadcast and Pro AV — Studio switching and professional video/audio processing leveraging large embedded memory and DSP resources.
• Compute & Storage Acceleration — Flash cache acceleration and server offload tasks that benefit from substantial logic and on-chip RAM.
• Medical & Imaging Systems — Diagnostic imaging and scanner control architectures that use reconfigurable logic and high-bandwidth memory buffering.

Unique Advantages

• High logic density: 900,000 logic elements enable integration of large, system-level functions on a single device, reducing external component count.
• Large on-chip memory: 59,234,304 RAM bits support deep buffering and data-path requirements without immediate dependence on external memory.
• Robust I/O capability: 504 I/O pins provide flexibility for wide parallel interfaces and mixed-signal front-end connections.
• Integrated high-speed connectivity: Series-level transceiver and hard IP support (including PCIe and 10 Gbps Ethernet) simplifies high-bandwidth link implementation.
• Compact, surface-mount package: 1152-FCBGA (35x35) packaging delivers a space-efficient footprint for dense system boards.
• Extended thermal grade: 0°C to 100°C operating range and extended-grade classification for deployments across varied environments.
• Power-conscious core operation: 870 mV–980 mV core voltage range supports power-optimized system design choices.

Why Choose 10AX090H2F34E1SG?

The 10AX090H2F34E1SG delivers a blend of high logic capacity, substantial embedded RAM, and broad I/O that suits mid-range, performance-oriented FPGA applications. Its Arria 10 GX series features—such as variable-precision DSP blocks, advanced clocking and PLL options, serial transceivers, and PCIe/10 Gbps Ethernet hard IP—provide a flexible foundation for communication, computing, and imaging designs.

Engineers and procurement teams seeking a surface-mount, extended-grade FPGA with significant on-chip resources will find this device appropriate for designs requiring dense logic integration, large internal memory, and high-speed link support while retaining power and configuration flexibility.

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