10AX090H2F34I2LG

The 10AX090H2F34I2LG is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 1152‑FBGA (35×35) package. It belongs to the Arria 10 device family of 20 nm mid-range FPGAs that emphasize higher performance and improved power efficiency for performance- and power-sensitive midrange applications.

With up to 900,000 logic elements, 59,234,304 bits of embedded RAM and 504 I/Os, this device targets applications that require large programmable logic capacity, substantial on-chip memory, and industrial operating range.

Key Features

• Logic Capacity — 900,000 logic elements (logic element cells) for complex programmable logic and system integration.
• Embedded Memory — Total RAM capacity of 59,234,304 bits to support large on-chip buffers and data storage.
• I/O and Package — 504 I/Os in a surface-mount 1152‑FCBGA (35×35) package for dense I/O routing and board-level integration.
• Power — Voltage supply range of 870 mV to 980 mV for core operation.
• Temperature and Grade — Industrial grade device with an operating temperature range of −40 °C to 100 °C suitable for industrial environments.
• Arria 10 Family Capabilities — Arria 10 devices provide a suite of device-level features including adaptive logic modules, variable-precision DSP blocks, embedded memory blocks, clock networks and PLLs, and hardened IP options such as PCIe Gen1/2/3 and serial transceivers as documented for the Arria 10 family.

Typical Applications

• Wireless Infrastructure — Channel and switch cards, remote radio heads and mobile backhaul equipment that need programmable logic and on-chip memory.
• Wireline Systems — Line cards, muxponders and transponders for 40G/100G systems where high logic density and I/O count are required.
• Broadcast and Pro AV — Studio switches and video transport/processing equipment benefiting from large embedded RAM and flexible I/O.
• Computing and Storage — Server acceleration, flash cache, and cloud infrastructure modules that leverage FPGA-based offload and in-system reconfiguration.

Unique Advantages

• High logic density: 900,000 logic elements enable large-scale integration of complex logic and custom accelerators on a single device.
• Substantial on-chip memory: 59,234,304 bits of RAM reduce dependence on external memory for buffering and real-time data processing.
• Industrial operating range: Rated from −40 °C to 100 °C to meet the thermal requirements of industrial deployments.
• Flexible I/O in a compact package: 504 I/Os in a 1152‑FCBGA (35×35) surface-mount package support dense board-level connectivity while minimizing PCB footprint.
• Low-voltage core operation: Core supply between 870 mV and 980 mV supports low-power design considerations.
• Arria 10 family ecosystem: Family-level features such as DSP blocks, clocking resources and hardened I/O/serdes IP provide a foundation for accelerating design development.

Why Choose 10AX090H2F34I2LG?

This Arria 10 GX FPGA combines large logic capacity, extensive embedded RAM and a high I/O count in an industrial-grade surface-mount package, making it well suited for midrange designs that require performance, integration and environmental robustness. It is appropriate for developers working on wireless and wireline infrastructure, broadcast processing, and computing/storage acceleration who need substantial on-chip resources.

As a member of the Arria 10 family, the device leverages the family’s 20 nm mid-range architecture and documented device-level features to provide a balance of performance and power efficiency for systems that must scale and adapt over the product lifecycle.

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