10AX090H3F34I2LG

IC FPGA 504 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 504 59234304 900000 1152-BBGA, FCBGA

Quantity 430 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O504Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs339620Number of Logic Elements/Cells900000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits59234304

Overview of 10AX090H3F34I2LG – Arria 10 GX FPGA, 900,000 Logic Elements, 504 I/O, 1152-FCBGA

The 10AX090H3F34I2LG is an Intel Arria 10 GX field programmable gate array (FPGA) offered in a 1152‑FBGA FCBGA package. This 20 nm mid-range device family delivers a balance of high logic density and power efficiency suitable for demanding, performance‑sensitive embedded and networking applications.

With 900,000 logic elements, 59,234,304 total RAM bits and 504 I/O pins, the device targets markets such as wireless and wireline infrastructure, broadcast, computing and storage, medical, and defense where large programmable logic resources, embedded memory and advanced I/O capabilities are required.

Key Features

  • Core Logic Capacity — 900,000 logic elements to implement large, complex FPGA designs and system-level integration.
  • Embedded Memory — 59,234,304 total RAM bits for on-chip buffering, packet processing and data buffering.
  • I/O and Interface Density — 504 general‑purpose I/O pins to support multiple parallel interfaces and external device connectivity.
  • Package and Mounting — 1152‑FCBGA (35×35) supplier device package; surface‑mount mounting for board-level deployment.
  • Power Supply — Core voltage supply range 870 mV to 930 mV for compatibility with targeted power delivery designs.
  • Operating Range and Grade — Industrial grade device rated for −40 °C to 100 °C operation.
  • Transceivers and High‑Speed IP (Series Features) — Arria 10 series supports low‑power serial transceivers, PCIe Gen1/2/3 hard IP and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet as part of the device family feature set.
  • DSP and Clocking (Series Features) — Variable‑precision DSP blocks and comprehensive PLL/clock network options are available across the Arria 10 family to support signal processing and timing requirements.
  • Power Efficiency and Process — 20 nm device family architecture with power‑saving technologies to reduce dynamic and static power in mid‑range, high‑performance designs.
  • Regulatory — RoHS compliant.

Typical Applications

  • Wireless Infrastructure — Channel processing, baseband and fronthaul aggregation using high logic density and embedded memory for real‑time signal processing.
  • Wireline Networking — 40G/100G line cards, muxponders and transponders leveraging the device family’s high‑speed serial capabilities and programmable packet processing.
  • Broadcast and Professional AV — Video switching, transport and codec acceleration where large on‑chip memory and logic enable real‑time media processing.
  • Computing and Storage — Server acceleration and flash cache controllers that use the device’s logic and memory resources for offload and low‑latency processing.
  • Medical and Military Systems — Diagnostic imaging, radar and secure communications that benefit from the industrial temperature range and high integration.

Unique Advantages

  • High Logic Density: 900,000 logic elements allow consolidation of multi‑function systems into a single FPGA, reducing board complexity.
  • Large On‑Chip Memory: 59,234,304 RAM bits support deep buffering and complex data manipulations without immediate reliance on external memory.
  • Robust I/O Count: 504 I/O pins enable multiple parallel interfaces and flexible connectivity options for system integration.
  • Industrial Temperature Range: Rated −40 °C to 100 °C for deployment in temperature‑sensitive and industrial environments.
  • Advanced Series IP: Access to Arria 10 series features such as PCIe hard IP and high‑speed serial transceivers for networking and high‑throughput applications.
  • Compact, Board‑Ready Package: 1152‑FCBGA (35×35) surface‑mount package simplifies assembly for compact system designs.

Why Choose 10AX090H3F34I2LG?

The 10AX090H3F34I2LG positions itself as a high‑density, industrial‑grade FPGA solution within the Intel Arria 10 GX family, combining substantial logic and memory resources with a wide I/O complement and series‑level high‑speed IP. It is suited to engineers designing mid‑range systems that require significant on‑chip programmability, deterministic processing and flexible interface support.

Supported by Arria 10 device documentation and development resources, this FPGA offers a scalable platform for networking, signal processing and embedded acceleration projects where long‑term design scalability and documented device behavior are important considerations.

Request a quote or submit a purchasing inquiry for 10AX090H3F34I2LG to receive pricing and availability details.

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