10AX090H4F34I3LG

IC FPGA 504 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 504 59234304 900000 1152-BBGA, FCBGA

Quantity 1,301 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O504Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs339620Number of Logic Elements/Cells900000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits59234304

Overview of 10AX090H4F34I3LG – Arria 10 GX FPGA, 900,000 logic elements, 1152‑FCBGA (35×35)

The 10AX090H4F34I3LG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) supplied in a 1152‑FBGA FCBGA package. It is part of the Arria 10 family of 20 nm mid‑range FPGAs and SoCs, delivering a combination of high logic density and embedded memory suitable for performance‑ and power‑sensitive midrange applications.

Targeted markets include wireless, wireline, broadcast, computing and storage, medical, and defense applications where reconfigurable logic, large on‑chip RAM, and robust I/O are required.

Key Features

  • Core Logic  Approximately 900,000 logic elements provide high logic density for complex digital designs and system acceleration tasks.
  • Embedded Memory  59,234,304 total RAM bits of on‑chip memory to support large buffers, caches, and streaming data operations.
  • I/O Capacity  504 general‑purpose I/O pins to support diverse external interfaces and board‑level connectivity.
  • Package & Mounting  1152‑FCBGA (35×35 mm) surface‑mount package for compact board integration and high pin count routing.
  • Voltage & Power  Core supply range 870 mV to 930 mV, enabling designs that target specific power domains and efficiency tradeoffs.
  • Operating Range & Grade  Industrial grade operation from −40 °C to 100 °C for deployment in a wide range of environmental conditions.
  • Arria 10 Device Family Features  Series‑level capabilities include fractional synthesis and I/O PLLs, low‑power serial transceivers, PCIe Gen1/2/3 hard IP, enhanced PCS hard IP for high‑speed Ethernet and Interlaken, dynamic and partial reconfiguration, and on‑device power management.
  • Reliability & Configuration  Device handbook and device‑level errata and design recommendations are available for system validation and configuration management.
  • RoHS Compliance  RoHS compliant for use in lead‑free manufacturing processes.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul systems that require reconfigurable logic and high throughput.
  • Wireline & Networking  40G/100G muxponders, transponders, and line cards where high I/O capacity and serial transceivers support optical and packet processing.
  • Broadcast & Professional AV  Studio switches, transport and video processing systems that benefit from large on‑chip memory and flexible I/O.
  • Computing & Storage  Server acceleration, flash cache, and cloud compute applications that leverage dense logic and embedded memory for offload tasks.
  • Medical & Defense Systems  Diagnostic imaging, radar, and electronic warfare applications that require industrial temperature operation and reconfigurable processing.

Unique Advantages

  • High Logic Density: ~900,000 logic elements enable integration of complex processing and control functions on a single device, reducing system BOM.
  • Large On‑Chip Memory: 59,234,304 RAM bits support deep buffering and high‑throughput data paths without immediate reliance on external DRAM.
  • Versatile I/O: 504 I/O pins provide flexibility for diverse interface requirements and board‑level partitioning.
  • Industrial Temperature Rating: −40 °C to 100 °C operation allows deployment in demanding thermal environments.
  • Compact, High‑Pin Package: 1152‑FCBGA (35×35) balances small PCB footprint with high connectivity for dense designs.
  • Family‑Level Performance and Power Options: Arria 10 family features focus on performance and power efficiency, supporting system designs that need both throughput and energy management.

Why Choose 10AX090H4F34I3LG?

The 10AX090H4F34I3LG combines the Arria 10 GX family’s midrange performance characteristics with high logic density, substantial on‑chip memory, and broad I/O capability in a compact FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for demanding deployments where reliability and regulatory compliance matter.

This part is appropriate for engineers designing midrange, power‑sensitive systems across communications, broadcast, compute acceleration, medical imaging, and defense applications who need a reconfigurable, high‑density FPGA with established device‑level documentation and configuration options.

Request a quote or submit an inquiry for 10AX090H4F34I3LG to receive pricing and availability information tailored to your design and volume needs.

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