10AX090H4F34I3LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 504 59234304 900000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,301 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 504 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 339620 | Number of Logic Elements/Cells | 900000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 59234304 |
Overview of 10AX090H4F34I3LG – Arria 10 GX FPGA, 900,000 logic elements, 1152‑FCBGA (35×35)
The 10AX090H4F34I3LG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) supplied in a 1152‑FBGA FCBGA package. It is part of the Arria 10 family of 20 nm mid‑range FPGAs and SoCs, delivering a combination of high logic density and embedded memory suitable for performance‑ and power‑sensitive midrange applications.
Targeted markets include wireless, wireline, broadcast, computing and storage, medical, and defense applications where reconfigurable logic, large on‑chip RAM, and robust I/O are required.
Key Features
- Core Logic Approximately 900,000 logic elements provide high logic density for complex digital designs and system acceleration tasks.
- Embedded Memory 59,234,304 total RAM bits of on‑chip memory to support large buffers, caches, and streaming data operations.
- I/O Capacity 504 general‑purpose I/O pins to support diverse external interfaces and board‑level connectivity.
- Package & Mounting 1152‑FCBGA (35×35 mm) surface‑mount package for compact board integration and high pin count routing.
- Voltage & Power Core supply range 870 mV to 930 mV, enabling designs that target specific power domains and efficiency tradeoffs.
- Operating Range & Grade Industrial grade operation from −40 °C to 100 °C for deployment in a wide range of environmental conditions.
- Arria 10 Device Family Features Series‑level capabilities include fractional synthesis and I/O PLLs, low‑power serial transceivers, PCIe Gen1/2/3 hard IP, enhanced PCS hard IP for high‑speed Ethernet and Interlaken, dynamic and partial reconfiguration, and on‑device power management.
- Reliability & Configuration Device handbook and device‑level errata and design recommendations are available for system validation and configuration management.
- RoHS Compliance RoHS compliant for use in lead‑free manufacturing processes.
Typical Applications
- Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul systems that require reconfigurable logic and high throughput.
- Wireline & Networking 40G/100G muxponders, transponders, and line cards where high I/O capacity and serial transceivers support optical and packet processing.
- Broadcast & Professional AV Studio switches, transport and video processing systems that benefit from large on‑chip memory and flexible I/O.
- Computing & Storage Server acceleration, flash cache, and cloud compute applications that leverage dense logic and embedded memory for offload tasks.
- Medical & Defense Systems Diagnostic imaging, radar, and electronic warfare applications that require industrial temperature operation and reconfigurable processing.
Unique Advantages
- High Logic Density: ~900,000 logic elements enable integration of complex processing and control functions on a single device, reducing system BOM.
- Large On‑Chip Memory: 59,234,304 RAM bits support deep buffering and high‑throughput data paths without immediate reliance on external DRAM.
- Versatile I/O: 504 I/O pins provide flexibility for diverse interface requirements and board‑level partitioning.
- Industrial Temperature Rating: −40 °C to 100 °C operation allows deployment in demanding thermal environments.
- Compact, High‑Pin Package: 1152‑FCBGA (35×35) balances small PCB footprint with high connectivity for dense designs.
- Family‑Level Performance and Power Options: Arria 10 family features focus on performance and power efficiency, supporting system designs that need both throughput and energy management.
Why Choose 10AX090H4F34I3LG?
The 10AX090H4F34I3LG combines the Arria 10 GX family’s midrange performance characteristics with high logic density, substantial on‑chip memory, and broad I/O capability in a compact FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for demanding deployments where reliability and regulatory compliance matter.
This part is appropriate for engineers designing midrange, power‑sensitive systems across communications, broadcast, compute acceleration, medical imaging, and defense applications who need a reconfigurable, high‑density FPGA with established device‑level documentation and configuration options.
Request a quote or submit an inquiry for 10AX090H4F34I3LG to receive pricing and availability information tailored to your design and volume needs.

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