10AX090H3F34E2SG

IC FPGA 504 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 504 59234304 900000 1152-BBGA, FCBGA

Quantity 266 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O504Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs339620Number of Logic Elements/Cells900000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits59234304

Overview of 10AX090H3F34E2SG – Arria 10 GX FPGA, 900,000 logic elements, 1152-FCBGA

The 10AX090H3F34E2SG is an Intel Arria 10 GX field programmable gate array (FPGA) optimized for mid-range, performance-sensitive applications. It leverages the Arria 10 device architecture to deliver a high-density, power-efficient FPGA building block suitable for communications, compute, broadcast, and imaging systems.

Key on-chip resources include 900,000 logic elements, 59,234,304 total RAM bits, and 504 general-purpose I/O pins. The device is supplied in a 1152-FCBGA (35×35) surface-mount package, operates from 0 °C to 100 °C, and uses a core voltage supply range of 870 mV to 930 mV.

Key Features

  • Core Logic  900,000 logic elements for implementing complex custom logic, control, and data-path functions.
  • Embedded Memory  59,234,304 total RAM bits provide large on-chip buffering and storage for high-throughput designs.
  • I/O and Interfaces  504 general-purpose I/O pins enable wide external connectivity and interface flexibility for diverse peripherals and memory systems.
  • High-speed Transceivers & Interfaces  Arria 10 GX devices include low-power serial transceivers and hard IP for industry-standard interfaces such as PCIe (Gen1/Gen2/Gen3) and multi‑gigabit connectivity as described in the device overview.
  • DSP and Processing Blocks  Variable-precision DSP blocks support signal processing and arithmetic-intensive workloads; device overview also references options for SoC integration with a hard processor system in the Arria 10 family.
  • Clocking and Configuration  Integrated clock networks, PLLs, and fractional synthesis support flexible clocking architectures and configuration options.
  • Package, Power and Mounting  1152-FCBGA (35×35) package, surface-mount mounting type, and a core voltage supply range of 870 mV to 930 mV to match system power rails.
  • Operating Conditions & Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C suitable for many commercial and communications environments.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment that require programmable logic density and high-speed I/O.
  • Wireline & Optical Networking  40G/100G muxponders, transponders, and line cards where on-chip memory, serial transceivers, and PCIe hard IP accelerate packet handling and transport functions.
  • Broadcast and Video Processing  Studio switching, video transport, and professional audio/video processing that benefit from large embedded RAM and DSP resources.
  • Compute & Storage Acceleration  Flash cache, server acceleration, and cloud computing tasks that leverage high logic density and on-chip memory for low-latency data paths.

Unique Advantages

  • High logic density: 900,000 logic elements enable complex system-level integration on a single device, reducing board count and BOM complexity.
  • Large on-chip memory: Over 59 million RAM bits provide substantial buffering and data storage to support high-throughput applications without immediate dependence on external memory.
  • Broad I/O capacity: 504 I/O pins allow flexible interfacing to peripherals, memory, and backplane systems in space-constrained designs.
  • Compact, manufacturable package: 1152-FCBGA (35×35) surface-mount package supports high-density PCB layouts and automated assembly.
  • Power-efficient 20 nm architecture: Arria 10 family design emphasizes performance-per-watt and includes power-saving technologies described in the device overview.
  • Extended-grade operating range: 0 °C to 100 °C and Extended grade classification match many commercial and communications deployment requirements.

Why Choose 10AX090H3F34E2SG?

The 10AX090H3F34E2SG Arria 10 GX FPGA provides a balance of high logic capacity, substantial embedded memory, and extensive I/O in a compact 1152-FCBGA package. It is positioned for mid-range, performance-sensitive designs where programmable logic density, on-chip RAM, and multi-gigabit connectivity are primary design drivers.

As part of the Intel Arria 10 device family, this device is suited to system designers building communications, compute, broadcast, and imaging applications that require scalable, power-efficient programmable logic with hardware-ready interfaces and DSP capabilities.

Request a quote or submit an RFQ today to obtain pricing and availability for 10AX090H3F34E2SG.

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