10AX090H3F34E2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 504 59234304 900000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 266 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 504 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 339620 | Number of Logic Elements/Cells | 900000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 59234304 |
Overview of 10AX090H3F34E2SG – Arria 10 GX FPGA, 900,000 logic elements, 1152-FCBGA
The 10AX090H3F34E2SG is an Intel Arria 10 GX field programmable gate array (FPGA) optimized for mid-range, performance-sensitive applications. It leverages the Arria 10 device architecture to deliver a high-density, power-efficient FPGA building block suitable for communications, compute, broadcast, and imaging systems.
Key on-chip resources include 900,000 logic elements, 59,234,304 total RAM bits, and 504 general-purpose I/O pins. The device is supplied in a 1152-FCBGA (35×35) surface-mount package, operates from 0 °C to 100 °C, and uses a core voltage supply range of 870 mV to 930 mV.
Key Features
- Core Logic 900,000 logic elements for implementing complex custom logic, control, and data-path functions.
- Embedded Memory 59,234,304 total RAM bits provide large on-chip buffering and storage for high-throughput designs.
- I/O and Interfaces 504 general-purpose I/O pins enable wide external connectivity and interface flexibility for diverse peripherals and memory systems.
- High-speed Transceivers & Interfaces Arria 10 GX devices include low-power serial transceivers and hard IP for industry-standard interfaces such as PCIe (Gen1/Gen2/Gen3) and multi‑gigabit connectivity as described in the device overview.
- DSP and Processing Blocks Variable-precision DSP blocks support signal processing and arithmetic-intensive workloads; device overview also references options for SoC integration with a hard processor system in the Arria 10 family.
- Clocking and Configuration Integrated clock networks, PLLs, and fractional synthesis support flexible clocking architectures and configuration options.
- Package, Power and Mounting 1152-FCBGA (35×35) package, surface-mount mounting type, and a core voltage supply range of 870 mV to 930 mV to match system power rails.
- Operating Conditions & Grade Extended-grade device with an operating temperature range of 0 °C to 100 °C suitable for many commercial and communications environments.
Typical Applications
- Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul equipment that require programmable logic density and high-speed I/O.
- Wireline & Optical Networking 40G/100G muxponders, transponders, and line cards where on-chip memory, serial transceivers, and PCIe hard IP accelerate packet handling and transport functions.
- Broadcast and Video Processing Studio switching, video transport, and professional audio/video processing that benefit from large embedded RAM and DSP resources.
- Compute & Storage Acceleration Flash cache, server acceleration, and cloud computing tasks that leverage high logic density and on-chip memory for low-latency data paths.
Unique Advantages
- High logic density: 900,000 logic elements enable complex system-level integration on a single device, reducing board count and BOM complexity.
- Large on-chip memory: Over 59 million RAM bits provide substantial buffering and data storage to support high-throughput applications without immediate dependence on external memory.
- Broad I/O capacity: 504 I/O pins allow flexible interfacing to peripherals, memory, and backplane systems in space-constrained designs.
- Compact, manufacturable package: 1152-FCBGA (35×35) surface-mount package supports high-density PCB layouts and automated assembly.
- Power-efficient 20 nm architecture: Arria 10 family design emphasizes performance-per-watt and includes power-saving technologies described in the device overview.
- Extended-grade operating range: 0 °C to 100 °C and Extended grade classification match many commercial and communications deployment requirements.
Why Choose 10AX090H3F34E2SG?
The 10AX090H3F34E2SG Arria 10 GX FPGA provides a balance of high logic capacity, substantial embedded memory, and extensive I/O in a compact 1152-FCBGA package. It is positioned for mid-range, performance-sensitive designs where programmable logic density, on-chip RAM, and multi-gigabit connectivity are primary design drivers.
As part of the Intel Arria 10 device family, this device is suited to system designers building communications, compute, broadcast, and imaging applications that require scalable, power-efficient programmable logic with hardware-ready interfaces and DSP capabilities.
Request a quote or submit an RFQ today to obtain pricing and availability for 10AX090H3F34E2SG.

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