10AX090H2F34I2SG

The 10AX090H2F34I2SG is an Intel Arria 10 GX field-programmable gate array in a 1152‑FCBGA (35×35 mm) surface-mount package. This 20 nm mid-range FPGA family member delivers a combination of high logic density, large embedded RAM, and a broad set of device-level features suited for high-performance, power-conscious designs across networking, broadcast, compute, and industrial markets.

Key Features

• Core Logic 900,000 logic elements and 339,620 logic blocks provide substantial programmable fabric for complex logic, control, and packet-processing functions.
• Embedded Memory 59,234,304 total RAM bits of on-chip memory to support buffering, caching, and high-throughput data paths.
• I/O Capacity 504 user I/O pins accommodate wide parallel interfaces and multiple external memory or peripheral connections.
• Series-Level IP and Transceivers Arria 10 device family features cited in the device overview include variable-precision DSP blocks, PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers for high-speed links.
• Clocking and PLLs Fractional synthesis and I/O PLL resources are highlighted for flexible clock generation and distribution across the device.
• Package and Mounting 1152-FCBGA (35×35 mm) supplier package in a surface-mount form factor suitable for production assembly.
• Power and Operating Range Core supply range 870 mV to 980 mV supports the device’s power domain requirements; industrial-grade operation from −40 °C to 100 °C.
• Standards and System Integration The Arria 10 overview identifies support for common memory and networking interfaces and system-level features such as SoC integration and dynamic/partial reconfiguration (series capability).

Typical Applications

• Wireless Infrastructure Channel processing and switch card functions in radio heads and mobile backhaul equipment can leverage the device’s logic density and transceiver/IP capabilities.
• Wireline Networking Use in 40G/100G muxponders, transponders and line cards where high-speed serial links and programmable packet processing are required.
• Broadcast and Media Studio switching, video transport and professional audio/video systems that need high-bandwidth buffering and custom logic pipelines.
• Compute and Storage Acceleration Flash caching, server acceleration, and cloud compute offload tasks benefitting from large embedded RAM and extensive logic resources.
• Industrial and Medical Systems Control, imaging, and real-time processing applications that require robust operating temperature range and high integration.

Unique Advantages

• High Logic Density: 900,000 logic elements enable implementation of complex algorithms and multi-function designs without external logic expansion.
• Large On-Chip Memory: 59.2 Mbit of embedded RAM reduces dependence on external memory for buffering and accelerates data-path performance.
• Extensive I/O: 504 I/Os provide flexibility for connecting wide parallel buses, multiple memory interfaces, and diverse peripherals.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation for deployment in temperature-challenging environments.
• Package Suitable for Production Assembly: 1152‑FCBGA (35×35) surface-mount package supports automated assembly and compact board layouts.
• Device-Family Integration: Arria 10 series-level features—DSP blocks, PLL clocking, PCIe/Ethernet hard IP and low-power transceivers—help shorten design cycles by providing common, reusable building blocks.

Why Choose 10AX090H2F34I2SG?

The 10AX090H2F34I2SG positions itself where high logic capacity, substantial on-chip memory, and broad I/O meet the needs of mid-range, high-performance applications. Its Arria 10 GX device-class capabilities, industrial temperature rating, and production-ready FCBGA packaging make it suitable for networking, media, compute acceleration, and other designs that require a balance of integration and programmable flexibility.

For teams that require scalable FPGA fabric with extensive memory and interfacing options, this device offers series-level IP and hardware features to reduce system complexity while supporting deployment in demanding thermal environments.

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