10AX090N2F40E1SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 600 59234304 900000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 441 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 339620 | Number of Logic Elements/Cells | 900000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 59234304 |
Overview of 10AX090N2F40E1SG – Arria 10 GX FPGA, 900,000 logic elements, 1517-FCBGA
The 10AX090N2F40E1SG is an Intel Arria 10 GX field programmable gate array (FPGA) offered in a 1517‑FBGA surface‑mount package. It is part of the Arria 10 family of 20 nm mid‑range FPGAs and SoCs designed for higher performance and improved power efficiency compared with previous mid‑range generations. Typical uses include mid‑range, high‑performance applications across markets such as wireless, wireline, broadcast, computing and storage, and medical systems.
Key Features
- Programmable Logic Capacity — 900,000 logic elements for implementing large custom logic and control functions.
- Embedded Memory — 59,234,304 total RAM bits to support memory‑intensive processing and large buffering requirements.
- High I/O Count — 600 I/Os to accommodate complex multi‑lane interfaces and dense board routing.
- Package and Mounting — 1517‑BBGA / 1517‑FCBGA (40×40) surface‑mount package for compact system integration.
- Power Supply Range — Core voltage specified from 870 mV to 980 mV (0.87–0.98 V) for low‑voltage operation.
- Operating Temperature — Extended grade operation from 0 °C to 100 °C for a broad range of deployment environments.
- Compliance — RoHS compliant.
- Family Characteristics — Based on the Arria 10 device family architecture: 20 nm process technology delivering performance and power efficiency suitable for mid‑range FPGA applications.
Typical Applications
- Wireless infrastructure — Channel and switch cards, remote radio head functions and mobile backhaul where programmable logic and embedded memory are needed for signal processing.
- Wireline and optical networking — 40G/100G muxponders, transponders and line cards that require high I/O density and programmable protocol handling.
- Broadcast and professional AV — Studio switching, transport and videoconferencing systems leveraging large logic capacity and embedded memory for real‑time processing.
- Computing and storage — Server acceleration, flash cache and cloud compute functions that benefit from FPGA offload and high memory capacity.
- Medical imaging and diagnostics — Imaging systems that use configurable logic and on‑chip memory for data acquisition and preprocessing.
Unique Advantages
- High logic density: 900,000 logic elements enable integration of complex algorithms and large control/state machines on a single device, reducing component count.
- Large on‑chip memory: 59,234,304 total RAM bits provide substantial embedded storage for buffering, frame memory, and intermediate data in streaming applications.
- Extensive I/O connectivity: 600 I/Os support multiple parallel interfaces and high‑pin‑count designs without external multiplexing.
- Compact system footprint: 1517‑FCBGA (40×40) surface‑mount package supports high‑density board designs and streamlined mechanical integration.
- Low‑voltage core operation: 870 mV to 980 mV core range helps designers target lower power budgets while meeting performance needs.
- Extended temperature rating: 0 °C to 100 °C operation provides flexibility for a wide range of deployed environments where extended grade is required.
Why Choose 10AX090N2F40E1SG?
The 10AX090N2F40E1SG positions itself as a high‑capacity, power‑aware mid‑range Arria 10 GX FPGA suitable for designs that demand significant programmable logic, large embedded memory, and broad I/O. Its 20 nm Arria 10 architecture balances performance and efficiency, making it appropriate for applications across networking, broadcast, compute acceleration, and imaging.
With its extended temperature grade, compact 1517‑FCBGA package, and RoHS compliance, this device delivers a scalable platform for development teams seeking to consolidate functionality, reduce board complexity, and leverage Intel’s Arria 10 device family features during product development.
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