10AX090N2F40I2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 600 59234304 900000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 812 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 339620 | Number of Logic Elements/Cells | 900000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 59234304 |
Overview of 10AX090N2F40I2LG – Arria 10 GX FPGA IC, 900,000 logic elements, 600 I/O, 1517-FCBGA
The 10AX090N2F40I2LG is an Intel Arria 10 GX field programmable gate array (FPGA) delivered in a 1517-FCBGA (40×40) package for surface-mount applications. It belongs to the Arria 10 device family of 20 nm mid-range FPGAs and SoCs and combines high logic density with substantial embedded memory and I/O capacity.
Designed for mid-range, performance- and power-sensitive markets, this device addresses applications across wireless, wireline, broadcast, computing/storage, medical, and military segments by offering a balance of performance, power-efficiency, and integration.
Key Features
- Logic capacity — 900,000 logic elements enabling large-scale programmable designs and complex digital functions.
- Embedded memory — 59,234,304 total RAM bits to support on-chip buffering, frame storage, and packet processing.
- I/O count — 600 I/O pins to support wide external connectivity and high-pin-count interfaces.
- Package and mounting — 1517-FCBGA (40×40) package in surface-mount form factor for compact high-density board implementations.
- Power supply — Core voltage range of 870 mV to 980 mV, suitable for the device’s specified operating conditions.
- Operating temperature — Industrial temperature rating from −40°C to 100°C for deployment in temperature-demanding environments.
- Industrial grade — Specified as an industrial-grade device to match applications requiring extended temperature operation.
- RoHS compliance — Environmentally compliant with RoHS requirements.
- Arria 10 family capabilities — Series-level features include variable-precision DSP blocks, embedded memory blocks, high-performance clock networks, and serial transceiver support as described for Arria 10 devices.
Typical Applications
- Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul systems leveraging the device’s logic and I/O density.
- Wireline networking — 40G/100G muxponders, transponders, and line cards that require substantial on-chip memory and high I/O counts.
- Broadcast and professional AV — Studio switches, transport, and videoconferencing equipment where programmable logic and memory support complex signal handling.
- Computing and storage — Flash cache, server acceleration, and cloud computing server functions that benefit from high logic capacity and embedded memory.
- Medical and defense systems — Diagnostic imaging, radar, and secure communications relying on industrial temperature range and robust device capabilities.
Unique Advantages
- High logic density: 900,000 logic elements provide headroom for complex algorithms, protocol stacks, and hardware accelerators on a single device.
- Large on-chip memory: Over 59 million bits of RAM reduce dependency on external memory for buffering and intermediate storage.
- Extensive I/O: 600 I/O pins accommodate multiple high-speed interfaces and parallel peripherals without external I/O expanders.
- Industrial-temperature operation: Specified −40°C to 100°C operation supports deployment in environments with wide temperature swings.
- Compact, high-pin-count package: 1517-FCBGA (40×40) FCBGA offers a compact footprint while delivering the pin count needed for complex system interfaces.
- Energy-conscious design: Series-level power-efficiency features and a defined core supply range (870 mV–980 mV) support power-sensitive designs.
Why Choose 10AX090N2F40I2LG?
The 10AX090N2F40I2LG positions itself as a high-capacity, mid-range FPGA option within the Intel Arria 10 family, combining substantial logic and memory resources with a large I/O complement and industrial temperature capability. Its specifications align with designs that require on-chip scale for complex processing, extensive peripheral connectivity, and deployment in demanding environments.
This part is suited for engineering teams building mid-range communications, broadcast, compute-acceleration, medical imaging, and defense systems that need a balance of performance, integration, and environmental tolerance, backed by the Arria 10 device family features and ecosystem.
Request a quote or submit an inquiry to receive pricing and availability information for 10AX090N2F40I2LG and to discuss how this Arria 10 GX FPGA can fit into your next design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018