10CL006YE144I7G

IC FPGA 88 I/O 144EQFP
Part Description

Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 88 276480 6272 144-LQFP Exposed Pad

Quantity 559 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFP Exposed PadNumber of I/O88Voltage1.2 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs392Number of Logic Elements/Cells6272
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits276480

Overview of 10CL006YE144I7G – Cyclone® 10 LP FPGA, 144-LQFP Exposed Pad

The 10CL006YE144I7G is an Intel Cyclone® 10 LP field programmable gate array (FPGA) in a 144‑LQFP exposed pad package. It provides a compact, surface‑mount programmable logic solution with 6,272 logic elements, on‑chip RAM, and 88 user I/O pins tailored for industrial‑grade designs.

With a 1.2 V core supply and an operating temperature range of −40 °C to 100 °C, this device is suited to applications that require deterministic custom logic, moderate memory capacity, and reliable operation across a wide temperature range.

Key Features

  • Core and Logic — 6,272 logic elements provide the programmable fabric required for custom logic, control paths, and glue logic integration.
  • On‑Chip Memory — 276,480 total RAM bits for buffering, FIFOs, and small lookup tables directly within the FPGA fabric.
  • I/O Count & Packaging — 88 user I/Os in a 144‑LQFP exposed pad package (supplier package: 144‑EQFP, 20×20) enabling dense signal routing in a compact footprint.
  • Mounting & Thermal — Surface mount device with an exposed pad to support board‑level thermal management and robust solder attachment.
  • Power — Standard core voltage of 1.2 V simplifies power architecture for systems designed around Cyclone® 10 LP devices.
  • Industrial Grade — Specified as Industrial grade with an operating temperature range of −40 °C to 100 °C for use in temperature‑challenging environments.
  • Standards Compliance — RoHS‑compliant for adherence to prevailing environmental requirements.

Typical Applications

  • Industrial systems — Industrial designs requiring an FPGA with an operating range of −40 °C to 100 °C can use this device for control logic and interfacing functions.
  • Board‑level programmable logic — Compact 144‑LQFP package with 88 I/Os supports implementations where PCB space and a high pin count are both considerations.
  • On‑chip buffering and data handling — 276,480 bits of RAM and 6,272 logic elements provide capacity for local buffering, FIFOs, and custom data paths.

Unique Advantages

  • Balanced logic and memory — The combination of 6,272 logic elements and substantial on‑chip RAM simplifies implementation of mid‑range FPGA functions without external memory for many use cases.
  • Compact package with thermal support — The 144‑LQFP exposed pad (20×20 supplier package) enables a small PCB footprint while providing an exposed pad for improved thermal dissipation.
  • Industrial temperature rating — Specified −40 °C to 100 °C operating range supports deployment in temperature‑sensitive industrial environments.
  • High I/O density — Eighty‑eight user I/Os allow flexible interfacing to peripherals and I/O buses without needing additional I/O expanders.
  • Environmentally compliant — RoHS compliance supports designs that must meet environmental regulations.

Why Choose 10CL006YE144I7G?

The 10CL006YE144I7G Cyclone® 10 LP FPGA delivers a practical balance of logic density, on‑chip RAM, and I/O capacity in a space‑efficient 144‑LQFP exposed pad package. Its 1.2 V core supply and industrial temperature rating make it suitable for engineers designing robust, board‑level programmable logic for industrial applications.

For teams that need a mid‑range FPGA from a recognized vendor, this device offers predictable on‑chip resources and packaging choices that help reduce BOM complexity while addressing thermal and environmental constraints.

Request a quote or submit an inquiry to purchase the 10CL006YE144I7G for your next design project.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up