10CL006YU256A7G

IC FPGA 176 I/O 256UBGA
Part Description

Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 176 276480 6272 256-LFBGA

Quantity 1,878 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-UBGA (14x14)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case256-LFBGANumber of I/O176Voltage1.2 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs392Number of Logic Elements/Cells6272
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits276480

Overview of 10CL006YU256A7G – Cyclone® 10 LP FPGA, 6,272 Logic Elements, 176 I/O, 256-LFBGA

The 10CL006YU256A7G is an Intel Cyclone® 10 LP field-programmable gate array (FPGA) in a compact 256-LFBGA package. It delivers 6,272 logic elements and 276,480 bits of on-chip RAM, making it suitable for small-to-medium density custom digital designs.

Qualified to AEC-Q100 and rated for an operating junction range of −40 °C to 125 °C, this automotive-grade FPGA targets in-vehicle and other harsh-environment embedded systems that require configurable logic, on-chip memory, and substantial I/O in a surface-mount, 14×14 UBGA form factor.

Key Features

  • Core Logic — 6,272 logic elements provide the programmable fabric for implementing custom digital functions and control logic.
  • On-chip Memory — 276,480 total RAM bits enable local buffering, packet staging, and state storage for finite-state machines and data processing.
  • I/O Capacity — 176 I/O pins give flexible connectivity for sensors, actuators, transceivers, and peripheral interfaces.
  • Package & Mounting — 256-LFBGA (supplier package: 256-UBGA, 14×14) in a surface-mount format supports compact board layouts and high-density systems.
  • Power — Core voltage specified at 1.2 V, enabling standard Cyclone 10 LP power architectures.
  • Automotive Qualification & Temperature Range — AEC-Q100 qualification with operating junction temperature from −40 °C to 125 °C for automotive and other high-reliability applications.
  • Compliance — RoHS compliant for environmental and manufacturing consistency.

Typical Applications

  • Automotive Embedded Control — Implement gateway logic, body control modules, or feature controllers where AEC-Q100 qualification and wide temperature tolerance are required.
  • Sensor Interfacing and Preprocessing — Use on-chip RAM and logic to preprocess signals from cameras, radar, or vehicle sensors before forwarding to higher-level processors.
  • Small-Form-Factor Electronic Modules — Compact 256-LFBGA packaging and surface-mount mounting suit tight-board-space modules and add-in carrier boards.
  • Custom Digital Functions — Implement protocol bridging, bit-level processing, and control state machines that benefit from reprogrammable logic and substantial I/O.

Unique Advantages

  • Automotive-Grade Qualification: AEC-Q100 qualification and −40 °C to 125 °C operating range support deployment in vehicle environments and other harsh conditions.
  • Balanced Logic and Memory: 6,272 logic elements paired with 276,480 RAM bits offers a practical balance for designs that need both combinational/sequential logic and local storage.
  • High I/O Count in a Compact Package: 176 I/O pins in a 256-LFBGA (14×14 UBGA) enable rich connectivity without a large PCB footprint.
  • Standard 1.2 V Core: 1.2 V core supply aligns with Cyclone 10 LP device operating options for predictable power design.
  • RoHS Compliant: Meets lead-free manufacturing requirements for global production and deployment.

Why Choose 10CL006YU256A7G?

The 10CL006YU256A7G positions itself as a compact, automotive-grade FPGA option within the Intel Cyclone® 10 LP family. With 6,272 logic elements, substantial on-chip RAM, and 176 I/O in a 256-LFBGA package, it is well suited for designers building vehicle electronics, sensor interfaces, and other embedded systems that demand reprogrammable logic combined with wide operating-temperature capability and AEC-Q100 qualification.

Choose this device when you need a configurable hardware building block that balances logic density, memory, I/O connectivity, and automotive qualification in a small surface-mount package.

Request a quote or submit an inquiry to purchase the 10CL006YU256A7G or to get more information about availability and lead time.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up