10CL006YU256A7G
| Part Description |
Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 176 276480 6272 256-LFBGA |
|---|---|
| Quantity | 1,878 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-UBGA (14x14) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 176 | Voltage | 1.2 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 392 | Number of Logic Elements/Cells | 6272 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 276480 |
Overview of 10CL006YU256A7G – Cyclone® 10 LP FPGA, 6,272 Logic Elements, 176 I/O, 256-LFBGA
The 10CL006YU256A7G is an Intel Cyclone® 10 LP field-programmable gate array (FPGA) in a compact 256-LFBGA package. It delivers 6,272 logic elements and 276,480 bits of on-chip RAM, making it suitable for small-to-medium density custom digital designs.
Qualified to AEC-Q100 and rated for an operating junction range of −40 °C to 125 °C, this automotive-grade FPGA targets in-vehicle and other harsh-environment embedded systems that require configurable logic, on-chip memory, and substantial I/O in a surface-mount, 14×14 UBGA form factor.
Key Features
- Core Logic — 6,272 logic elements provide the programmable fabric for implementing custom digital functions and control logic.
- On-chip Memory — 276,480 total RAM bits enable local buffering, packet staging, and state storage for finite-state machines and data processing.
- I/O Capacity — 176 I/O pins give flexible connectivity for sensors, actuators, transceivers, and peripheral interfaces.
- Package & Mounting — 256-LFBGA (supplier package: 256-UBGA, 14×14) in a surface-mount format supports compact board layouts and high-density systems.
- Power — Core voltage specified at 1.2 V, enabling standard Cyclone 10 LP power architectures.
- Automotive Qualification & Temperature Range — AEC-Q100 qualification with operating junction temperature from −40 °C to 125 °C for automotive and other high-reliability applications.
- Compliance — RoHS compliant for environmental and manufacturing consistency.
Typical Applications
- Automotive Embedded Control — Implement gateway logic, body control modules, or feature controllers where AEC-Q100 qualification and wide temperature tolerance are required.
- Sensor Interfacing and Preprocessing — Use on-chip RAM and logic to preprocess signals from cameras, radar, or vehicle sensors before forwarding to higher-level processors.
- Small-Form-Factor Electronic Modules — Compact 256-LFBGA packaging and surface-mount mounting suit tight-board-space modules and add-in carrier boards.
- Custom Digital Functions — Implement protocol bridging, bit-level processing, and control state machines that benefit from reprogrammable logic and substantial I/O.
Unique Advantages
- Automotive-Grade Qualification: AEC-Q100 qualification and −40 °C to 125 °C operating range support deployment in vehicle environments and other harsh conditions.
- Balanced Logic and Memory: 6,272 logic elements paired with 276,480 RAM bits offers a practical balance for designs that need both combinational/sequential logic and local storage.
- High I/O Count in a Compact Package: 176 I/O pins in a 256-LFBGA (14×14 UBGA) enable rich connectivity without a large PCB footprint.
- Standard 1.2 V Core: 1.2 V core supply aligns with Cyclone 10 LP device operating options for predictable power design.
- RoHS Compliant: Meets lead-free manufacturing requirements for global production and deployment.
Why Choose 10CL006YU256A7G?
The 10CL006YU256A7G positions itself as a compact, automotive-grade FPGA option within the Intel Cyclone® 10 LP family. With 6,272 logic elements, substantial on-chip RAM, and 176 I/O in a 256-LFBGA package, it is well suited for designers building vehicle electronics, sensor interfaces, and other embedded systems that demand reprogrammable logic combined with wide operating-temperature capability and AEC-Q100 qualification.
Choose this device when you need a configurable hardware building block that balances logic density, memory, I/O connectivity, and automotive qualification in a small surface-mount package.
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