10CL006ZE144I8G

The 10CL006ZE144I8G is an Intel Cyclone® 10 LP field-programmable gate array (FPGA) offered in an industrial grade package. It provides a low-voltage 1.0 V core option and combines on-chip RAM and programmable logic to support mid-density embedded and control applications.

Designed for surface-mount assembly in a 144-LQFP exposed‑pad package, this device is suited for systems requiring up to 6,272 logic elements, 276,480 bits of RAM, and up to 88 general-purpose I/O pins within an industrial operating temperature range.

Key Features

• Logic Capacity — 6,272 logic elements with 392 logic array blocks (LABs) to implement custom logic, state machines, and glue logic.
• On‑chip Memory — 276,480 total RAM bits for buffers, FIFOs, and small data structures without external memory.
• I/O Resources — Up to 88 I/O pins to interface with sensors, actuators, peripherals and bus interfaces.
• Core Voltage — 1.0 V supply (listed as 1 V to 1 V) consistent with the lower core voltage device option documented for Cyclone 10 LP.
• Package and Mounting — 144‑LQFP exposed pad package (supplier device package: 144‑EQFP 20×20) for surface-mount assembly.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Industrial Control & Automation — Implement motor control logic, I/O aggregation, and deterministic state machines using the available logic elements and I/O.
• Sensor Aggregation and Pre‑Processing — Use on‑chip RAM and logic to buffer, filter, and pre-process data from multiple sensor channels before forwarding to a host.
• Interface Bridging and Protocol Conversion — Map, adapt, and translate between digital peripherals and system buses using flexible I/O and programmable logic.
• Embedded Glue Logic — Replace discrete glue components by consolidating combinatorial and sequential logic within the FPGA fabric.

Unique Advantages

• Balanced Logic and Memory — 6,272 logic elements paired with 276,480 RAM bits provide a mid-density mix suitable for control, interfacing, and modest data buffering needs.
• Industrial‑grade Operation — Specified for −40 °C to 100 °C operation, enabling deployment in a wide range of industrial environments.
• Low-voltage Core — 1.0 V core voltage option aligns with lower-power system designs that require a reduced core supply.
• Generous I/O Count — 88 I/O pins accommodate multi-channel sensor interfaces and peripheral connectivity without external expander devices.
• Surface-Mount Exposed-Pad Package — 144-LQFP exposed‑pad footprint in a 20×20 supplier package supports standard PCB assembly workflows.
• RoHS Compliant — Meets RoHS requirements for restricted substances in manufacturing.

Why Choose 10CL006ZE144I8G?

The 10CL006ZE144I8G delivers a practical balance of programmable logic, embedded memory, and I/O in an industrial-grade, surface-mount package. Its 6,272 logic elements and 276,480 bits of RAM make it a solid choice for mid-density embedded designs that need local processing, protocol adaptation, or custom control logic.

With a 1.0 V core option, exposed‑pad 144‑LQFP packaging, and an extended −40 °C to 100 °C operating range, this Cyclone® 10 LP device is positioned for applications where integration, predictable supply requirements, and industrial environmental tolerance are important.

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