10CL010YE144A7G
| Part Description |
Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 88 423936 10320 144-LQFP Exposed Pad |
|---|---|
| Quantity | 1,109 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 88 | Voltage | 1.2 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 645 | Number of Logic Elements/Cells | 10320 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 423936 |
Overview of 10CL010YE144A7G – Cyclone® 10 LP FPGA, 10,320 logic elements, 144-LQFP
The 10CL010YE144A7G is an Intel Cyclone® 10 LP field programmable gate array (FPGA) IC delivering 10,320 logic elements and 423,936 bits of on-chip RAM for custom digital designs. Its 88 general-purpose I/Os, compact 144‑LQFP exposed-pad package, and 1.2 V core supply make it suited to embedded and automotive-qualified implementations that require programmable logic, memory, and I/O in a single device.
Rated for automotive use with AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C, this device targets applications that demand long-term reliability and resilience to wide temperature swings while maintaining a small PCB footprint.
Key Features
- Core & logic 10,320 logic elements to implement custom digital functions, state machines, and glue logic within a single programmable device.
- On‑chip memory 423,936 total RAM bits for buffering, FIFOs, and small on‑chip data storage to support complex logic and real‑time tasks.
- I/O density 88 user I/Os to interface with sensors, peripherals, and domain-specific interfaces without large external multiplexing.
- Power and voltage 1.2 V core supply specified for this device to align with low‑voltage system power rails and predictable power delivery.
- Package & mounting 144‑LQFP exposed pad (supplier package: 144‑EQFP 20×20) in a surface‑mount format that supports compact PCB integration and thermal dissipation via the exposed pad.
- Automotive qualification AEC‑Q100 qualification and Automotive grade designation for designs requiring automotive standards and qualification flow.
- Wide operating temperature Specified operation from −40 °C to 125 °C to meet designs that operate across extended temperature ranges.
- Compliance RoHS‑compliant to support environmental and regulatory requirements for electronic assemblies.
Typical Applications
- Automotive control systems — AEC‑Q100 qualification and wide temperature rating make this FPGA suitable for in‑vehicle control, domain controllers, and safety‑adjacent logic functions.
- Embedded sensor processing — On‑chip RAM and 10,320 logic elements enable real‑time preprocessing, filtering, and aggregation of sensor data with ample I/O for sensor interfaces.
- Custom interface bridging — Use the available I/Os and programmable logic to implement protocol conversion, bus bridging, or bespoke peripheral interfaces in space‑constrained designs.
Unique Advantages
- Substantial programmable resources: 10,320 logic elements combined with 423,936 RAM bits provide a balanced mix of logic and memory for control, signal processing, and glue logic tasks.
- Automotive‑grade reliability: AEC‑Q100 qualification and an extended operating temperature range support deployment in temperature‑challenging automotive environments.
- Compact, thermally mindful package: 144‑LQFP exposed pad supports small PCBs while the exposed pad assists thermal management for sustained operation.
- Low‑voltage core: 1.2 V core supply aligns with modern low‑voltage system architectures and helps streamline power design.
- RoHS compliant: Designed to meet current environmental compliance expectations for electronic assemblies.
Why Choose 10CL010YE144A7G?
This Cyclone® 10 LP device positions programmable logic, meaningful on‑chip memory, and a practical I/O count within a compact, automotive‑qualified package. It is well suited to engineering teams building embedded and automotive systems that require configurable hardware, predictable operating limits, and component qualification for harsh temperature environments.
As a member of the Cyclone® 10 LP family, the 10CL010YE144A7G offers a balance of integration and reliability for designs that need programmable flexibility without excessive board area or external memory. Its specification set supports scalable development and deployment within automotive and embedded product lifecycles.
Request a quote today to get pricing and availability for the 10CL010YE144A7G and to discuss how it fits your next embedded or automotive program.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018