5AGXFB3H4F40I3NAA
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 704 19822592 362000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 23 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA, FC (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 704 | Voltage | 1.12 V - 1.18 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 17110 | Number of Logic Elements/Cells | 362000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 19822592 |
Overview of 5AGXFB3H4F40I3NAA – Arria V GX FPGA, 1517-BBGA FCBGA
The 5AGXFB3H4F40I3NAA is an Arria V GX Field Programmable Gate Array (FPGA) in a 1517-BBGA FCBGA package designed for industrial applications. It provides high logic density, substantial on-chip memory, and broad I/O capability in a surface-mount form factor for space-constrained, performance-focused designs.
Key value propositions include a large pool of logic elements for complex hardware logic, approximately 18.9 Mbits of embedded RAM for data buffering and storage, and an industrial operating range for deployment in demanding environments.
Key Features
- Core Logic — 362,000 logic elements to implement complex FPGA logic, state machines, and custom hardware accelerators.
- Embedded Memory — Approximately 18.9 Mbits of on-chip RAM for FIFOs, buffers, and local data storage.
- I/O Density — 704 I/O pins to support extensive peripheral interfaces and board-level connectivity.
- Power and Voltage — Core supply voltage range of 1.12 V to 1.18 V to match system power-rail design requirements.
- Package and Mounting — 1517-BBGA (FCBGA) package, supplier device package 1517-FBGA, FC (40×40); surface-mount device suitable for automated PCB assembly.
- Thermal and Environmental — Industrial-grade operating temperature from −40 °C to 100 °C for reliable operation in harsh environments.
- Regulatory Compliance — RoHS compliant.
Typical Applications
- Industrial Control — High logic capacity and industrial temperature rating make this FPGA suitable for motor control, factory automation, and PLC extensions where reliability and density matter.
- Communications and Networking — Large I/O count and abundant logic elements support protocol processing, packet handling, and interface bridging in network equipment.
- Signal Processing — Significant embedded memory and logic resources enable buffering and implementation of custom DSP pipelines for video, radar, or sensor data processing.
- Embedded Acceleration — Use as a hardware acceleration platform where large logic and on-chip RAM reduce external memory dependency and latency.
Unique Advantages
- High Logic Capacity: 362,000 logic elements allow dense integration of complex designs and multi-function systems on a single device.
- Substantial On-Chip RAM: Approximately 18.9 Mbits of embedded memory reduces reliance on external RAM for many buffering and caching tasks.
- Extensive I/O: 704 I/Os provide flexibility for multiple interfaces, parallel buses, and board-level interconnect without external multiplexing.
- Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in temperature-challenging environments.
- Compact, Assembly-Friendly Package: 1517-BBGA FCBGA surface-mount package supports automated manufacturing and compact PCB layouts.
- Low-Voltage Core: Narrow core supply window (1.12 V to 1.18 V) for predictable power design and supply sequencing.
Why Choose 5AGXFB3H4F40I3NAA?
This Arria V GX FPGA balances high logic density, substantial embedded memory, and large I/O capacity within an industrial-grade, surface-mount 1517-BBGA package. It is positioned for designers who require a robust, high-capacity programmable fabric that operates across a wide temperature range and integrates into automated production flows.
Choose this device for designs that demand scalable logic resources, on-chip memory for latency-sensitive tasks, and a package that supports high-density board layouts while meeting RoHS compliance.
Request a quote or submit an inquiry to get pricing and availability for the 5AGXFB3H4F40I3NAA. Our team can provide technical and procurement support to help evaluate this FPGA for your project needs.

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