5AGXFB3H6F40C6G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 704 19822592 362000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 399 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA, FC (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 704 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 17110 | Number of Logic Elements/Cells | 362000 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 19822592 |
Overview of 5AGXFB3H6F40C6G – Arria V GX Field Programmable Gate Array (FPGA), 362,000 logic elements, ~19.8 Mbits RAM, 704 I/Os
The 5AGXFB3H6F40C6G is an Arria V GX family Field Programmable Gate Array in a 1517-BBGA FCBGA package, offered in commercial grade. It provides a high-density programmable-logic fabric with 362,000 logic elements and approximately 19.8 Mbits of on-chip RAM, paired with 704 general-purpose I/O pins for designs that require substantial logic capacity, embedded memory and extensive external connectivity. The device operates from a core supply range of 1.07 V to 1.13 V and supports an operating temperature range of 0 °C to 85 °C.
Key Features
- Logic Capacity — 362,000 logic elements to implement complex custom logic, state machines and datapaths.
- Embedded Memory — Approximately 19.8 Mbits of on-chip RAM for buffering, FIFOs and local data storage.
- High I/O Count — 704 I/O pins to support wide parallel interfaces, multi-channel peripherals and extensive board-level connectivity.
- Package & Mounting — 1517-BBGA (FCBGA) package, supplier package listed as 1517-FBGA, FC (40×40); surface-mount device suitable for compact PCB implementations.
- Power — Core supply voltage specified between 1.07 V and 1.13 V for power-domain planning and regulator selection.
- Commercial Grade & Temperature Range — Rated for commercial operation from 0 °C to 85 °C.
- Regulatory Compliance — RoHS-compliant for lead-free manufacturing processes.
Typical Applications
- Prototyping and FPGA-based development — Use the device’s large logic and memory resources to validate complex hardware designs and system prototypes.
- Custom signal processing — Implement bespoke DSP pipelines and buffering using the abundant logic elements and embedded RAM.
- I/O-intensive interface bridging — Leverage 704 I/Os to connect multiple peripherals, parallel sensors or external FPGAs and ASICs.
- Embedded compute acceleration — Offload compute kernels to programmable fabric where local memory and high logic density accelerate key tasks.
Unique Advantages
- High-density programmable fabric: 362,000 logic elements enable implementation of large, integrated systems on a single device, reducing external component count.
- Substantial on-chip memory: Approximately 19.8 Mbits of RAM supports large buffer depths and localized data storage, minimizing external memory bandwidth requirements.
- Extensive I/O resources: 704 I/Os provide flexibility for wide buses, multiple interfaces and parallel sensor/actuator connections.
- Compact package option: 1517-BBGA FCBGA in a surface-mount form factor simplifies high-density board layouts while keeping the footprint predictable for PCB designers.
- Commercial temperature rating: Rated 0 °C to 85 °C for general-purpose deployments in standard electronics environments.
- RoHS-compliant: Conforms to lead-free manufacturing requirements for modern assembly processes.
Why Choose 5AGXFB3H6F40C6G?
The 5AGXFB3H6F40C6G Arria V GX FPGA combines large logic capacity, significant embedded memory and a high I/O count in a single commercial-grade FCBGA package. It is suited to designs that need consolidated programmable logic, localized RAM and extensive board-level connectivity without resorting to multiple discrete components. For development teams and procurement organizations seeking a high-density FPGA with verifiable electrical and packaging attributes—core voltage window, operating temperature range and RoHS compliance—this device delivers a clear specification-driven option.
Request a quote or submit a purchase inquiry today to evaluate the 5AGXFB3H6F40C6G for your next high-density programmable logic design.

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