5AGXFB3H6F40C6N
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 704 19822592 362000 1517-BBGA |
|---|---|
| Quantity | 692 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA | Number of I/O | 704 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 17110 | Number of Logic Elements/Cells | 362000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 19822592 |
Overview of 5AGXFB3H6F40C6N – Arria V GX FPGA, 704 I/O, 362,000 logic elements
The 5AGXFB3H6F40C6N is an Intel Arria V GX field-programmable gate array supplied in a 1517-BBGA package. This commercial-grade FPGA integrates a high-density logic fabric with substantial on-chip memory and a large I/O count to support complex system designs.
With 17110 logic array blocks (totaling 362,000 logic elements), approximately 19.82 Mbits of embedded memory, and 704 I/O pins, the device is positioned to address demanding digital integration, interface-rich designs, and applications that require significant on-chip logic and memory resources while operating within a standard commercial temperature range.
Key Features
- Logic Density — 17110 logic array blocks providing a total of 362,000 logic elements for implementing large-scale digital logic and custom datapaths.
- On-chip Memory — Approximately 19.82 Mbits of embedded RAM for buffering, state storage, and memory-centric processing functions.
- High I/O Count — 704 available I/O pins to support wide parallel interfaces, multiple peripherals, and dense connectivity requirements.
- Package and Mounting — Surface-mount 1517-BBGA package (supplier package: 1517-FBGA, 40×40) for compact board-level integration.
- Power Supply — Core voltage specified between 1.07 V and 1.13 V to match system power-rail planning.
- Operating Temperature — Rated for commercial operation from 0 °C to 85 °C.
- Compliance — RoHS-compliant to meet environmental and manufacturing requirements.
Unique Advantages
- Substantial logic capacity: 362,000 logic elements enable complex FPGA implementations without immediate migration to larger devices.
- Significant embedded memory: Approximately 19.82 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs.
- Extensive I/O resources: 704 I/Os provide flexibility for multi-channel interfaces and integration of diverse peripherals on a single device.
- Compact BGA package: The 1517-BBGA (1517-FBGA, 40×40) package balances board density with thermal and routing considerations for high-pin-count FPGAs.
- Predictable power envelope: A defined core voltage range (1.07–1.13 V) supports precise power-supply design and margin planning.
- Commercial-grade availability: Rated for 0 °C to 85 °C operation to suit standard commercial product deployments.
Why Choose 5AGXFB3H6F40C6N?
The 5AGXFB3H6F40C6N delivers a balanced combination of logic capacity, embedded memory, and a high I/O count in a commercial-grade Arria V GX FPGA. Its specification set makes it appropriate for designs that require substantial on-chip resources and dense connectivity while maintaining a predictable power and thermal profile.
This device is suitable for development teams and OEMs who need a scalable FPGA backbone with verified electrical and configuration characteristics from the Arria V family, RoHS compliance, and a compact BGA footprint for board-level integration.
Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the 5AGXFB3H6F40C6N.

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