5AGXFB3H6F40C6N

IC FPGA 704 I/O 1517FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 704 19822592 362000 1517-BBGA

Quantity 692 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGANumber of I/O704Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs17110Number of Logic Elements/Cells362000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19822592

Overview of 5AGXFB3H6F40C6N – Arria V GX FPGA, 704 I/O, 362,000 logic elements

The 5AGXFB3H6F40C6N is an Intel Arria V GX field-programmable gate array supplied in a 1517-BBGA package. This commercial-grade FPGA integrates a high-density logic fabric with substantial on-chip memory and a large I/O count to support complex system designs.

With 17110 logic array blocks (totaling 362,000 logic elements), approximately 19.82 Mbits of embedded memory, and 704 I/O pins, the device is positioned to address demanding digital integration, interface-rich designs, and applications that require significant on-chip logic and memory resources while operating within a standard commercial temperature range.

Key Features

  • Logic Density — 17110 logic array blocks providing a total of 362,000 logic elements for implementing large-scale digital logic and custom datapaths.
  • On-chip Memory — Approximately 19.82 Mbits of embedded RAM for buffering, state storage, and memory-centric processing functions.
  • High I/O Count — 704 available I/O pins to support wide parallel interfaces, multiple peripherals, and dense connectivity requirements.
  • Package and Mounting — Surface-mount 1517-BBGA package (supplier package: 1517-FBGA, 40×40) for compact board-level integration.
  • Power Supply — Core voltage specified between 1.07 V and 1.13 V to match system power-rail planning.
  • Operating Temperature — Rated for commercial operation from 0 °C to 85 °C.
  • Compliance — RoHS-compliant to meet environmental and manufacturing requirements.

Unique Advantages

  • Substantial logic capacity: 362,000 logic elements enable complex FPGA implementations without immediate migration to larger devices.
  • Significant embedded memory: Approximately 19.82 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs.
  • Extensive I/O resources: 704 I/Os provide flexibility for multi-channel interfaces and integration of diverse peripherals on a single device.
  • Compact BGA package: The 1517-BBGA (1517-FBGA, 40×40) package balances board density with thermal and routing considerations for high-pin-count FPGAs.
  • Predictable power envelope: A defined core voltage range (1.07–1.13 V) supports precise power-supply design and margin planning.
  • Commercial-grade availability: Rated for 0 °C to 85 °C operation to suit standard commercial product deployments.

Why Choose 5AGXFB3H6F40C6N?

The 5AGXFB3H6F40C6N delivers a balanced combination of logic capacity, embedded memory, and a high I/O count in a commercial-grade Arria V GX FPGA. Its specification set makes it appropriate for designs that require substantial on-chip resources and dense connectivity while maintaining a predictable power and thermal profile.

This device is suitable for development teams and OEMs who need a scalable FPGA backbone with verified electrical and configuration characteristics from the Arria V family, RoHS compliance, and a compact BGA footprint for board-level integration.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the 5AGXFB3H6F40C6N.

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