5AGXFB5K4F40I5

The 5AGXFB5K4F40I5 is an Intel Arria V GX field-programmable gate array supplied in a 1517-BBGA package with a 1517-FBGA (40×40) supplier footprint. This industrial-grade FPGA integrates high logic density and substantial on-chip memory to support complex, I/O-rich embedded designs.

With a core supply window of 1.07 V to 1.13 V, 704 user I/Os, and an operating range from −40 °C to 100 °C, this device is intended for applications that require high integration, deterministic power planning, and extended temperature operation.

Key Features

• High Logic Density — 420,000 logic elements enable the implementation of large-scale custom logic and complex digital functions on a single device.
• Embedded Memory — Approximately 23.6 Mbits of total on-chip RAM (23,625,728 bits) for data buffering, state storage, and memory-intensive logic.
• Extensive I/O — 704 user I/Os provide flexible interface options for peripheral, bus, and mezzanine connectivity.
• Industrial Temperature Rating — Rated for operation from −40 °C to 100 °C, supporting deployment in temperature-challenging environments.
• Precise Core Power — Narrow voltage supply range of 1.07 V to 1.13 V simplifies power-rail planning and regulation.
• Package & Mounting — 1517-BBGA package (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for high-density PCB layouts.
• RoHS Compliant — Conforms to RoHS requirements for material compliance.

Typical Applications

• High-density digital processing — Leverage 420,000 logic elements and ~23.6 Mbits of embedded RAM to consolidate complex processing pipelines and custom accelerators into a single FPGA.
• I/O-intensive systems — Use the 704 I/Os to interface multiple peripherals, sensors, or external memory buses without additional glue logic.
• Industrial embedded systems — Industrial-grade temperature range and RoHS compliance make this device suitable for control, monitoring, and automation hardware operating in demanding environments.

Unique Advantages

• High integration density: Large logic and memory resources reduce the need for external components and simplify system architecture.
• Flexible interfacing: 704 I/Os enable broad connectivity choices for mixed-signal front ends, large sensor arrays, or multi-channel data paths.
• Thermal robustness: −40 °C to 100 °C operation supports designs that must withstand a wide ambient temperature range.
• Predictable power planning: A defined core voltage window (1.07–1.13 V) aids in regulator selection and power-sequence design.
• Compact, production-ready package: 1517-BBGA / 1517-FBGA (40×40) surface-mount package enables high-density PCB implementation for space-constrained applications.
• Regulatory compliance: RoHS compliance simplifies product environmental requirements and sourcing.

Why Choose 5AGXFB5K4F40I5?

The 5AGXFB5K4F40I5 balances substantial logic capacity, significant embedded memory, and high I/O count in an industrial-rated FPGA package from Intel's Arria V GX family. Its combination of resources and temperature capability makes it a practical choice for designers seeking to consolidate complex digital functions and diverse interfaces into a single, production-ready component.

This part is well suited for engineering teams targeting high-density, I/O-rich designs where predictable power rails, extended temperature operation, and RoHS compliance are required. The clear electrical parameters and package options support robust PCB implementation and system-level planning.

Request a quote or submit your requirements to receive pricing and availability for the 5AGXFB5K4F40I5. Our team can provide support for lead times and order placement.