5AGXFB7K4F40I5G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 704 2975744 504140 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,040 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA, FC (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 704 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 23786 | Number of Logic Elements/Cells | 504140 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 2975744 |
Overview of 5AGXFB7K4F40I5G – Arria V GX FPGA, 704 I/Os, 504,140 Logic Elements, 1517-BBGA FCBGA
The 5AGXFB7K4F40I5G is an Arria V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in an industrial-grade specification. It provides a high density of programmable logic and embedded memory with a large I/O count in a 1517-ball FCBGA package for surface-mount applications.
Designed for applications that require dense logic integration and robust operating range, this device delivers 504,140 logic elements, approximately 2.98 Mbits of embedded RAM, and 704 I/O pins while operating across a -40 °C to 100 °C temperature range and a core supply window of 1.07 V to 1.13 V.
Key Features
- High Logic Capacity 504,140 logic elements to implement complex custom logic, accelerators, and large state machines.
- Embedded Memory Approximately 2.98 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage.
- Extensive I/O 704 I/O pins suitable for high-density interfacing, parallel busses, and multi-channel systems.
- Industrial Grade Specified as an industrial-grade device with an operating temperature range of -40 °C to 100 °C for deployment in temperature-challenging environments.
- Power Supply Core voltage supply specified between 1.07 V and 1.13 V to guide power delivery and regulation design.
- Package and Mounting 1517-BBGA FCBGA package (supplier device package: 1517-FBGA, FC, 40 × 40) in a surface-mount form factor for standard PCB assembly flows.
- Regulatory RoHS compliant.
Typical Applications
- Industrial Control Systems Use the device’s industrial grade temperature range and high logic density for programmable control, motion control, and real-time I/O processing.
- High-Density I/O Platforms 704 I/Os enable multi-channel sensor aggregation, parallel data capture, and complex board-level interfacing.
- Networking and Communication Systems Large logic capacity and on-chip RAM support custom packet processing, buffering, and protocol handling.
- Data Acquisition and Instrumentation Embedded RAM and wide I/O count support high-throughput data capture, preprocessing, and local memory buffering.
Unique Advantages
- Substantial Logic Resources: 504,140 logic elements allow designers to consolidate multiple functions into a single FPGA, reducing board-level complexity.
- Significant On-Chip Memory: Approximately 2.98 Mbits of embedded RAM supports local buffering and accelerates data-path performance without external memory.
- Large I/O Footprint: 704 I/Os enable high channel counts and flexible interface options for dense system designs.
- Industrial Temperature Range: Specified -40 °C to 100 °C operation for reliable use in temperature-demanding environments.
- Surface-Mount FCBGA Package: 1517-ball FCBGA in a standard 40 × 40 supplier package balances density and manufacturability for production assemblies.
- RoHS Compliant: Conforms to RoHS requirements for regulatory and environmental compatibility.
Why Choose 5AGXFB7K4F40I5G?
The 5AGXFB7K4F40I5G positions itself as a high-density, industrial-grade FPGA solution with a strong combination of logic capacity, embedded memory, and extensive I/O in a compact FCBGA package. Its specified operating voltage and temperature range make it suitable for demanding embedded systems where on-board integration and robustness matter.
This device is appropriate for engineers and procurement teams building complex control, data acquisition, and communications systems that require consolidation of functionality, significant local memory, and a large number of external interfaces while maintaining compliance with RoHS requirements.
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