5AGXFB7K4F40I3N

The 5AGXFB7K4F40I3N is an Intel Arria V GX field programmable gate array (FPGA) offered in an industrial grade. This high-density FPGA delivers extensive logic capacity and on-chip memory in a compact 1517-FBGA (40×40) surface-mount package.

Its combination of 504,000 logic elements, approximately 27.7 Mbits of embedded memory, and 704 user I/O pins makes it suited to configurable-logic designs that require large logic fabrics, significant embedded RAM, and substantial I/O connectivity while operating across an industrial temperature range.

Key Features

• High-density core — 504,000 logic elements provide a large programmable fabric for complex logic implementations and parallel processing.
• Embedded memory — Approximately 27.7 Mbits of on-chip RAM to support data buffering, FIFOs, and local storage for logic functions.
• Extensive I/O — 704 user I/O pins to support wide bus interfaces, multiple peripherals, and high-pin-count system integration.
• Low-voltage core — Core voltage supply range of 1.12 V to 1.18 V for the device power domain.
• Industrial operating range — Rated for operation from −40 °C to 100 °C to meet harsher environmental requirements.
• Package and mounting — 1517-BBGA / 1517-FBGA (40×40) surface-mount package for compact board-level integration.
• Compliance — RoHS compliant.

Typical Applications

• High-density custom logic — Implement large-scale, user-defined logic functions leveraging 504,000 logic elements.
• Memory-intensive designs — Use embedded RAM (≈27.7 Mbits) for buffering, packet processing, or local data storage within the FPGA fabric.
• I/O-rich systems — Integrate multiple high-pin-count interfaces and peripherals with 704 available I/O pins.
• Industrial equipment — Deploy in systems that require operation across −40 °C to 100 °C while retaining high integration in a surface-mount FBGA package.

Unique Advantages

• Highly integrated logic and memory: Large logic element count paired with substantial on-chip RAM reduces external component needs and simplifies board-level design.
• Wide I/O capacity: 704 I/O pins provide flexibility for parallel buses, multiple peripherals, and extensive system interconnect.
• Industrial temperature qualification: Rated from −40 °C to 100 °C for reliable operation in demanding environments.
• Compact surface-mount package: 1517-FBGA (40×40) enables dense PCB layouts while maintaining high pin counts.
• Controlled core power domain: Defined supply range (1.12 V–1.18 V) supports predictable power budgeting and design planning.
• RoHS compliant: Meets common environmental and materials requirements for modern electronics manufacturing.

Why Choose 5AGXFB7K4F40I3N?

The 5AGXFB7K4F40I3N Arria V GX FPGA brings significant programmable logic capacity, substantial embedded memory, and a high I/O count in a compact industrial-grade FBGA package. It is suitable for engineering teams that require a scalable, high-density FPGA fabric with defined core voltage requirements and extended temperature operation.

Manufactured by Intel and documented in the Arria V device datasheet, this device is positioned for designers who need integrated logic, on-chip storage, and ample I/O in applications where industrial temperature tolerance and surface-mount packaging are important.

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