5CEBA5F23C7N

The 5CEBA5F23C7N is a Cyclone® V E field programmable gate array (FPGA) in a 484-ball BGA package designed for commercial embedded and I/O‑dense applications. It combines a large FPGA fabric with substantial on‑chip RAM and a broad I/O count to support control, protocol bridging, and system‑level integration tasks.

As a member of the Cyclone V family, the device leverages TSMC 28‑nm low‑power process technology and a nominal 1.1 V core domain, delivering an efficient platform for bandwidth and logic‑intensive designs while maintaining commercial temperature and voltage ranges.

Key Features

• Logic Capacity Approximately 77,000 logic elements, enabling complex digital logic and control implementations.
• Embedded Memory Approximately 5,001,216 bits (≈5 Mbits) of on‑chip RAM for buffering, state storage, and small memory structures.
• I/O Density 240 general‑purpose I/O pins to support multiple external interfaces, sensors, and peripherals.
• Voltage Range Core supply range specified at 1.07 V to 1.13 V, consistent with Cyclone V series 1.1 V core operation.
• Package and Mounting 484‑ball BGA (supplier package: 484‑FBGA, 23×23) in a surface‑mount format for compact board integration.
• Operating Temperature Commercial grade operation from 0 °C to 85 °C for standard industrial and consumer environments.
• RoHS Compliant Manufactured to meet RoHS environmental requirements.
• Series‑Level Architecture Part of the Cyclone V family built on 28‑nm low‑power (28LP) technology, with series features such as M10K memory blocks and variable‑precision DSP resources (series documentation).

Typical Applications

• Industrial Control Motor control, PLC front‑end logic, and protocol conversion where substantial logic and moderate on‑chip RAM are required.
• Communications and Networking Interface bridging, packet buffering, and I/O aggregation leveraging high I/O count and embedded RAM.
• Embedded Systems Custom peripherals, sensor aggregation, and glue logic for SoC and microcontroller‑based designs.
• Consumer and Commercial Electronics Feature control, display interface management, and peripheral timing where commercial temperature operation is appropriate.

Unique Advantages

• High Logic Density: Enables complex FPGA designs with approximately 77,000 logic elements for substantial on‑chip functionality.
• Integrated Memory: Approximately 5 Mbits of embedded RAM reduces the need for external memory for buffering and local storage.
• Generous I/O Count: 240 I/Os simplify board routing and allow multiple parallel interfaces without external multiplexing.
• Compact Surface‑Mount Packaging: 484‑FBGA (23×23) package provides high pin density in a compact footprint for space‑constrained PCBs.
• Commercial‑Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.
• Series Proven Technology: Built on Cyclone V family attributes (28‑nm low‑power process and 1.1 V core architecture) for predictable integration into Cyclone V‑based designs.

Why Choose 5CEBA5F23C7N?

The 5CEBA5F23C7N provides a balanced combination of logic capacity, embedded memory, and high I/O count in a compact 484‑BGA package, making it well suited for commercial embedded and interface‑focused designs. Its supply and thermal ranges align with standard Cyclone V family operation, helping streamline development when migrating or scaling within the Cyclone V product line.

Engineers selecting this device benefit from substantial on‑chip resources (logic and RAM), a high density of external I/Os, and the ecosystem and documentation available for Cyclone V devices—allowing designs to scale and remain maintainable over product lifecycles.

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