5CEBA7F23C8N

The 5CEBA7F23C8N is an Intel Cyclone® V E field-programmable gate array (FPGA) in a 484‑BGA (23×23) surface-mount package. It combines high logic capacity, substantial on-chip memory, and flexible I/O to address mid-to-high density embedded designs.

Built on a 28‑nm low-power process with a nominal 1.1 V core, this device targets applications in industrial, wireless and wireline systems where integration, power efficiency, and package density matter. The device operates from a 1.07 V to 1.13 V supply and is rated for commercial temperature operation (0 °C to 85 °C).

Key Features

• Logic Capacity — 149,500 logic elements for implementing complex digital functions and mid-to-large sized designs.
• Embedded Memory — Approximately 7.88 Mbits of on-chip RAM (7,880,704 bits) to support high-bandwidth buffering, state machines, and data storage on-chip.
• I/O and Package — 240 general-purpose I/Os in a compact 484‑BGA (23×23) surface-mount package, enabling dense interconnects in space-constrained boards.
• Power and Voltage — Core supply range of 1.07 V to 1.13 V; built on a 28‑nm low-power process with a 1.1 V core voltage as described for the Cyclone V family.
• Memory & DSP Architecture — Series-level Cyclone V features include M10K embedded memory blocks with ECC options and variable-precision DSP blocks for arithmetic and signal processing acceleration.
• Configuration & Integration — Cyclone V family capabilities include hard memory controllers and integrated transceiver and fabric features (as described in the Cyclone V device overview), enabling tighter system integration.
• Compliance & Mounting — RoHS‑compliant and surface-mount BGA packaging for modern assembly processes.
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.

Typical Applications

• Industrial control — Embedded logic, real-time interfaces, and on-chip memory for motor control, sensor aggregation, and automation controllers.
• Wireless infrastructure — Baseband, protocol processing, and FPGA-accelerated functions that benefit from integrated DSP blocks and embedded memory.
• Wireline communications — Packet processing, framing, and interface bridging where dense I/O and on-chip buffering reduce external component count.
• Embedded acceleration — Hardware offload for compute-intensive tasks using the device’s DSP resources and large logic element count.

Unique Advantages

• High logic density: 149,500 logic elements provide ample resources for complex digital designs without moving to a larger device family.
• Substantial on-chip RAM: Approximately 7.88 Mbits of embedded memory reduces dependence on external memory and improves latency for buffering and caches.
• Broad I/O capability in a compact package: 240 I/Os in a 484‑BGA (23×23) footprint enable densely routed, surface-mount board designs.
• Low-voltage operation: Narrow core supply window (1.07 V to 1.13 V) aligned with the Cyclone V 1.1 V core architecture supports power-optimized system design.
• Family-level integration options: Cyclone V device features such as M10K memory blocks, variable-precision DSP, and hard memory controllers provide design flexibility and acceleration opportunities.
• RoHS compliant: Environmentally compliant materials simplify regulatory handling in commercial products.

Why Choose 5CEBA7F23C8N?

The 5CEBA7F23C8N positions itself as a capable, commercially graded Cyclone V E FPGA for projects that require high logic capacity, significant on-chip memory, and dense I/O in a compact BGA package. Its 28‑nm low-power heritage and device-level features described in the Cyclone V family provide a balance of integration and efficiency for industrial, wireless, and wireline applications.

This device is suited to engineering teams looking to consolidate functions into a single FPGA, reduce external component count, and leverage family-level capabilities like M10K memory and DSP resources to accelerate development and deployment.

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