5CGTFD9A5U19A7N

The 5CGTFD9A5U19A7N is an Intel Cyclone® V GT field-programmable gate array (FPGA) offered in a 484‑FBGA package. It delivers high logic density and substantial on-chip memory for designs that require programmable logic, embedded RAM, and flexible I/O integration.

Designed for markets including industrial, wireless/wireline, military, and automotive, this device combines a low-power 28‑nm process architecture with qualification and thermal range suitable for demanding environments.

Key Features

• Logic Capacity — 301,000 logic elements offering a high-density fabric for complex digital functions and algorithm implementation.
• Embedded Memory — Total on-chip RAM of 14,251,008 bits (approximately 14.25 Mbits) to support large buffers, FIFOs, and memory-mapped logic.
• I/O — 240 general-purpose I/O pins to interface with multiple peripherals, sensors, and high-speed links.
• Process and Core Voltage — Built on TSMC 28‑nm low-power (28LP) process with a nominal 1.1 V core; this part specifies a supply range of 1.07 V to 1.13 V.
• Automotive Qualification — AEC‑Q100 qualification and Automotive grade designation for applications that require automotive-level component qualification.
• Operating Temperature — Extended operating range from −40 °C to 125 °C for deployment in temperature-stressed environments.
• Package and Mounting — 484‑FBGA package (supplier device package: 484‑UBGA, 19×19) with surface-mount assembly.
• Compliance — RoHS‑compliant manufacturing and materials.
• Series-Level Capabilities — Cyclone V GT family features such as integrated transceivers and hard memory controllers are part of the device family capability set.

Typical Applications

• Automotive Systems — Use in automotive control and processing modules leveraging AEC‑Q100 qualification and the −40 °C to 125 °C operating range.
• Industrial Control — High-density logic and abundant embedded RAM support motor control, PLC offload, and deterministic I/O processing in industrial environments.
• Wireless and Wireline Infrastructure — Series-level integrated transceivers and hard memory controllers support bandwidth and protocol processing needs in communications equipment.
• Military and Ruggedized Designs — Extended temperature capability and qualified components align with system requirements for rugged and defense applications.

Unique Advantages

• High Logic Density: 301,000 logic elements enable implementation of complex state machines, DSP pipelines, and custom accelerators on a single device.
• Significant On-Chip Memory: Approximately 14.25 Mbits of embedded RAM reduce reliance on external memory for buffering and low-latency data paths.
• Automotive-Grade Qualification: AEC‑Q100 qualification combined with an extended temperature range provides confidence for vehicle and harsh-environment deployments.
• Low-Power Silicon Foundation: Fabricated on a 28‑nm low-power process with a nominal 1.1 V core and a specified supply window of 1.07–1.13 V for power-sensitive designs.
• Flexible I/O and Packaging: 240 I/O pins in a 484‑FBGA (484‑UBGA, 19×19) package enable dense board-level integration and high pin-count interfacing.
• Regulatory and Environmental Readiness: RoHS compliance simplifies regulatory acceptance for global product programs.

Why Choose 5CGTFD9A5U19A7N?

The 5CGTFD9A5U19A7N positions itself as a high-capacity, automotive‑qualified Cyclone V GT FPGA suitable for applications that demand substantial logic resources, on-chip memory, and robust operating conditions. Its 28‑nm low-power foundation and defined core supply range support efficient system design while the extended temperature rating and AEC‑Q100 qualification address reliability requirements for automotive and rugged applications.

This device fits teams and programs that need a scalable FPGA fabric with strong on-chip memory and I/O flexibility, backed by the Cyclone V series capabilities for connectivity and memory interfacing.

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