5CGTFD9C5F23I7N

IC FPGA 224 I/O 484FBGA
Part Description

Cyclone® V GT Field Programmable Gate Array (FPGA) IC 224 14251008 301000 484-BGA

Quantity 1,102 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O224Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs113560Number of Logic Elements/Cells301000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits14251008

Overview of 5CGTFD9C5F23I7N – Cyclone® V GT FPGA, 301,000 Logic Elements

The 5CGTFD9C5F23I7N is a Cyclone V GT field-programmable gate array (FPGA) IC optimized for cost- and power-sensitive applications. Built on TSMC’s 28‑nm low‑power process and enhanced with integrated transceivers and hard memory controllers, this device targets industrial, communications, and defense applications that require substantial programmable logic and on‑chip memory.

This surface-mount device is supplied in a 484‑BGA (484‑FBGA, 23×23) package, supports a core voltage range of 1.07 V to 1.13 V, and operates over an industrial temperature range of −40 °C to 100 °C.

Key Features

  • Logic Capacity — 301,000 logic elements (cells) provide substantial programmable fabric for complex logic, control, and data processing tasks.
  • Logic Modules — 113,560 logic modules for flexible implementation of combinational and sequential logic structures.
  • Embedded Memory — Approximately 14.25 Mbits of on‑chip RAM (14,251,008 bits) to support buffering, lookup tables, and local data storage.
  • I/O Density — 224 general-purpose I/O pins to interface with external devices, sensors, memories, and peripherals.
  • High‑Speed Interfaces — Cyclone V GT family enhancements include integrated transceivers and hard memory controllers for high‑bandwidth external interfaces (as described in the Cyclone V device documentation).
  • Power Supply — Narrow core voltage operating window from 1.07 V to 1.13 V to support stable low‑power operation and predictable power budgeting.
  • Package and Mounting — 484‑BGA surface‑mount package (484‑FBGA, 23×23) for compact board integration and high pin density.
  • Industrial Temperature Range — Rated for −40 °C to 100 °C, suitable for industrial environments.
  • RoHS Compliant — Meets RoHS environmental requirements for lead‑free assembly.

Typical Applications

  • Industrial Control Systems — Programmable logic and abundant on‑chip RAM enable motor control, PLC functions, and deterministic I/O handling in factory and process automation.
  • Wireless and Wireline Communications — Integrated transceivers and high I/O count support packet processing, protocol offload, and interface bridging in base stations and network equipment.
  • Defense and Aerospace Electronics — Large logic capacity and industrial temperature support compute‑intensive signal processing and system control functions in ruggedized platforms.
  • High‑Volume, Cost‑Sensitive Designs — Cyclone V GT architecture is suitable for designs that require a balance of integration and cost efficiency in mass-production deployments.

Unique Advantages

  • Substantial Programmable Fabric: 301,000 logic elements and 113,560 logic modules provide headroom for complex state machines, accelerators, and control logic without external ASICs.
  • Significant On‑Chip Memory: Approximately 14.25 Mbits of embedded RAM reduces dependence on external memory for many buffering and lookup tasks, simplifying board design.
  • High I/O Count: 224 I/Os accommodate multiple peripheral interfaces, sensors, and memory buses while preserving board routing flexibility.
  • Industrial Robustness: Rated for −40 °C to 100 °C operation and supplied in a compact 484‑BGA package for reliable deployment in industrial environments.
  • Low‑Voltage Core: A narrow core supply range (1.07 V–1.13 V) supports predictable power delivery and efficient thermal design.
  • Environmental Compliance: RoHS‑compliant construction supports regulatory and manufacturing requirements.

Why Choose 5CGTFD9C5F23I7N?

The 5CGTFD9C5F23I7N delivers a balanced combination of large programmable logic capacity, substantial embedded memory, and high I/O density in a compact 484‑BGA package. Its Cyclone V GT architecture and low‑power 28‑nm foundation make it suitable for designers seeking integration and cost efficiency for industrial, communications, and defense applications.

Choose this FPGA when your design requires a scalable, high‑logic device with built‑in features for high‑bandwidth interfaces and robust temperature performance. The part is appropriate for teams focused on reducing BOM complexity while retaining the flexibility of programmable logic.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the 5CGTFD9C5F23I7N.

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