5CGTFD9E5F31I7N

The 5CGTFD9E5F31I7N is an Intel Cyclone V GT FPGA supplied in an 896-ball FBGA (31 × 31) surface-mount package. It delivers a high logic capacity and ample on-chip memory in a compact BGA footprint for space-constrained designs.

Designed for applications across industrial, wireless and wireline, and military markets, the Cyclone V family emphasizes low-power operation and system integration with features such as integrated transceivers and hard memory controllers.

Key Features

• Logic Capacity — Contains 301,000 logic elements to implement complex digital functions and processing pipelines.
• Embedded Memory — Approximately 14.25 Mbits of on-chip RAM (14,251,008 bits) for buffering, FIFOs and local storage.
• I/O Density — 480 user I/O pins support wide parallel interfaces and multiple external device connections.
• Package & Mounting — 896-FBGA (31 × 31) package, surface-mount mounting for high-density board designs.
• Power — Core supply range 1.07 V to 1.13 V to support low-voltage operation.
• Operating Range — Industrial-grade operating temperature from −40 °C to 100 °C for robust operation in demanding environments.
• Compliance — RoHS-compliant device for regulatory compliance in many markets.
• Cyclone V Family Capabilities — Family features include TSMC 28‑nm low-power (28LP) process technology, integrated transceivers and hard memory controllers, and architecture elements such as enhanced 8‑input adaptive logic modules and variable‑precision DSP blocks as described in the Cyclone V device overview.

Typical Applications

• Industrial Control and Automation — Industrial-grade temperature range and 480 I/O allow integration into factory controllers, motion control systems and sensor aggregation hubs.
• Wireless and Wireline Infrastructure — Integrated transceivers and hard memory controllers support data-path and protocol processing in base stations, backhaul and network equipment.
• Embedded Processing and Acceleration — Large logic capacity and substantial embedded RAM enable hardware acceleration of compute-intensive tasks and custom data-path implementations.
• Military and Rugged Systems — Wide operating temperature and high-density package make the device suitable for ruggedized electronics where industrial-grade components are required.

Unique Advantages

• High Logic Density: 301,000 logic elements provide headroom for complex FPGA designs and multiple concurrent functions.
• Significant On-Chip Memory: Approximately 14.25 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Ample I/O: 480 I/O pins accommodate broad interface requirements without sacrificing board-level routing flexibility.
• Industrial Operating Range: Rated from −40 °C to 100 °C to support reliable operation in harsh and temperature-variable environments.
• Low-Voltage Core: Narrow core supply range (1.07 V–1.13 V) aligns with low-power system design goals.
• Compact High-Density Package: 896-FBGA (31 × 31) delivers high pin count in a compact footprint for space-constrained assemblies.

Why Choose 5CGTFD9E5F31I7N?

The 5CGTFD9E5F31I7N combines substantial logic resources, significant embedded memory, and a high I/O count in an industrial-grade Cyclone V GT package. Its low-voltage core and family-level enhancements such as integrated transceivers and hard memory controllers make it well suited for designers building high-bandwidth, power-conscious systems in industrial, wireless/wireline, and rugged applications.

This part is a practical option for teams that need scalable FPGA capacity in a compact 896-FBGA footprint, with the thermal and regulatory attributes required for long-term deployment in challenging environments.

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