5CGXBC3B6F23C7N

The 5CGXBC3B6F23C7N is a Cyclone® V GX field-programmable gate array in a 484-ball BGA package designed for commercial, cost-sensitive applications requiring moderate logic density and on-chip memory. Built on the Cyclone V family architecture, it provides a balance of programmable logic, embedded memory, and I/O capacity suitable for industrial, wireless/wireline, and other high-volume applications.

Key Features

• Fabric Capacity: Approximately 31,500 logic elements, delivering moderate density for control, protocol, and DSP-lean designs.
• Embedded Memory: Approximately 1.38 Mbits of on-chip RAM for buffering, packet storage, and local data processing.
• I/O and Package: 208 user I/O in a 484-FBGA (23×23) surface-mount package, enabling dense board-level integration and flexible interfacing.
• Power and Core Voltage: Core supply range 1.07 V to 1.13 V (family nominal 1.1 V), supporting low-power operation consistent with the Cyclone V device family.
• Operating Range and Grade: Commercial grade with an ambient operating temperature range of 0 °C to 85 °C.
• Family Architecture Highlights: Cyclone V family features include an enhanced 8-input adaptive logic module (ALM), variable-precision DSP blocks, and integrated hard memory controllers as documented in the Cyclone V device overview.
• RoHS Compliant: Conforms to RoHS requirements for lead-free assembly and environmental compliance.

Typical Applications

• Industrial Control: Implement motor control, PLC interfacing, or factory automation logic where moderate logic density and reliable I/O are required.
• Wireless and Wireline Systems: Use for protocol bridging, packet buffering, and custom interface logic leveraging on-chip memory and DSP resources.
• High-Volume Consumer and Commercial Electronics: Integrate custom peripherals, user interfaces, or pre-processing functions in cost-sensitive products.

Unique Advantages

• Balanced Logic and Memory: ~31,500 logic elements combined with ~1.38 Mbits of embedded RAM supports a wide range of mid-density designs without external memory dependency.
• Compact, High-Density Package: 484-FBGA (23×23) surface-mount package with 208 I/O enables compact board layouts and extensive connectivity options.
• Low-Voltage Core Operation: Narrow core voltage window (1.07–1.13 V) aligned with the Cyclone V family’s low-power 28 nm process characteristics to help manage system power budgets.
• Family-Level Integration: Cyclone V family features such as enhanced ALMs, variable-precision DSP blocks, hard memory controllers, and documented SoC options provide design scalability and documented implementation guidance.
• Commercial Availability and Compliance: Commercial-grade device with RoHS compliance suitable for high-volume, cost-sensitive product lines.

Why Choose 5CGXBC3B6F23C7N?

5CGXBC3B6F23C7N positions designers to implement mid-density FPGA functions where on-chip memory, moderate logic capacity, and a compact BGA footprint are priorities. Its Cyclone V family architecture provides architectural features—enhanced ALMs, DSP resources, and hard memory controllers—that simplify common embedded functions while maintaining a low-power core voltage profile.

This part is well suited for teams developing commercial electronics, industrial control systems, and communication endpoints that require a mix of programmable logic, embedded RAM, and flexible I/O in a surface-mount BGA package, backed by Cyclone V device documentation and development resources.

Request a quote or submit a quote for 5CGXBC3B6F23C7N to check availability and lead times. Consult the Cyclone V device documentation for full technical details and design guidance.