5CGXBC3B7U15C8N
| Part Description |
Cyclone® V GX Field Programmable Gate Array (FPGA) IC 144 1381376 31500 324-LFBGA |
|---|---|
| Quantity | 502 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-UBGA (15x15) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LFBGA | Number of I/O | 144 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11900 | Number of Logic Elements/Cells | 31500 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1381376 |
Overview of 5CGXBC3B7U15C8N – Cyclone® V GX FPGA, 31,500 logic elements, 144 I/O, 324-LFBGA
The 5CGXBC3B7U15C8N is an Intel Cyclone V GX field-programmable gate array (FPGA) in a 324-LFBGA package designed for cost-sensitive, high-volume applications. Built on the Cyclone V family architecture, this device combines a fabric of 31,500 logic elements with integrated transceiver and memory-oriented features suitable for industrial, wireless/wireline and military system designs.
Key value propositions include low-power 28 nm process technology and a tightly integrated FPGA fabric that supports high-bandwidth interfaces while keeping supply and thermal requirements targeted for commercial-grade deployments.
Key Features
- Fabric Density — 31,500 logic elements for implementing mid-range logic, control and interface functions.
- Embedded Memory — Approximately 1.38 Mbits of on-chip RAM to support buffering, FIFOs and small on-chip data stores.
- I/O and Connectivity — 144 user I/O pins for flexible interfacing to external peripherals and systems; enhanced Cyclone V GX devices include integrated transceivers and hard memory controller features at the device-family level.
- Process and Core Voltage — TSMC 28 nm low-power process technology with a device core supply range of 1.07 V to 1.13 V (nominal 1.1 V).
- Package and Mounting — 324-LFBGA (supplier package 324-UBGA, 15×15 mm) in a surface-mount form factor for compact board layouts.
- Operating Range — Commercial-grade operation from 0 °C to 85 °C.
- Standards and Compliance — RoHS compliant.
Typical Applications
- Industrial Control — Implement motor control logic, sensor aggregation, and deterministic I/O processing where commercial-grade temperature ranges and compact packaging are required.
- Wireless and Wireline Infrastructure — Use the Cyclone V GX fabric and device-family transceiver/memory controller features for protocol handling, packet buffering, and interface bridging in infrastructure equipment.
- Defense and Military Systems — Deploy in communication, signal-processing and interface-conversion roles that leverage on-chip memory and moderate logic capacity for mission-specific implementations.
- High-volume Consumer/Commercial Electronics — Integrate as a mid-density programmable logic element for feature control, display/UX management, or peripheral aggregation in cost-sensitive products.
Unique Advantages
- Balanced Logic and Memory — 31,500 logic elements paired with approximately 1.38 Mbits of embedded RAM provide a practical balance for control, buffering and data-path tasks without external memory in many designs.
- Low-power 28 nm Process — The Cyclone V family’s 28 nm low-power process and 1.1 V core nominal operation reduce core power consumption relative to older nodes, supporting power-sensitive designs.
- Flexible I/O Count — 144 I/Os enable diverse peripheral interfacing and subsystem integration on compact PCBs.
- Compact, Surface-Mount Package — 324-LFBGA (15×15 mm UBGA) delivers a high pin-count, small footprint solution for space-constrained boards.
- Commercial Temperature Rating — Rated for 0 °C to 85 °C operation, suitable for a wide range of indoor and controlled-environment applications.
- RoHS Compliant — Meets environmental compliance requirements for lead-free assembly and global distribution.
Why Choose 5CGXBC3B7U15C8N?
The 5CGXBC3B7U15C8N positions itself as a practical mid-density Cyclone V GX FPGA option that combines a substantial logic element count with on-chip RAM, a broad I/O complement and a compact BGA package. Its 28 nm low-power foundation and 1.07–1.13 V core supply range make it attractive for designs that need energy-efficient programmable logic without moving to higher-density, higher-cost devices.
This device is well suited to engineering teams targeting commercial-grade industrial, wireless/wireline and defense applications that require a programmable, integrated solution with clear supply, thermal and package characteristics. It also benefits designs that prioritize time-to-market and BOM simplification through embedded memory and logic capacities.
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