5CGXBC4C6F23C7N

IC FPGA 240 I/O 484FBGA
Part Description

Cyclone® V GX Field Programmable Gate Array (FPGA) IC 240 2862080 50000 484-BGA

Quantity 77 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O240Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18868Number of Logic Elements/Cells50000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2862080

Overview of 5CGXBC4C6F23C7N – Cyclone® V GX Field Programmable Gate Array (FPGA) IC 240 I/O 2.86 Mbit RAM 50k LE 484-BGA

The 5CGXBC4C6F23C7N is a Cyclone® V GX-series FPGA in a 484-ball FBGA package, designed for mid-density, cost-sensitive commercial applications. It combines programmable fabric, embedded memory, and a wide I/O complement to address industrial, wireless/wireline and communications designs that require a balance of logic capacity, on-chip RAM, and integrated high-speed interfaces.

Built on the Cyclone V device family architecture, this commercial-grade device targets systems that benefit from lower power operation, integrated transceivers and hard memory controllers while remaining simple to package and deploy in surface-mount assemblies.

Key Features

  • Logic Capacity — 50,000 logic elements provide substantial programmable logic for mid-density designs and custom datapath implementation.
  • Embedded Memory — Approximately 2.86 Mbits of on-chip RAM to support buffering, FIFOs, and local storage; the Cyclone V family also uses M10K memory blocks with soft ECC in its device architecture.
  • I/O and Connectivity — 240 general-purpose I/O pins and the Cyclone V GX family’s integrated transceivers and hard memory controllers support a range of external interfaces and high-speed links.
  • Process and Core Voltage — Device architecture uses a 28‑nm low‑power silicon process with a nominal 1.1 V core; this part specifies a supply range of 1.07 V to 1.13 V for core operation.
  • Package and Mounting — Surface-mount 484-FBGA (23 × 23) package simplifies board integration while keeping a compact footprint.
  • Operating Range — Commercial-grade operating temperature from 0 °C to 85 °C for standard commercial deployments.
  • Environmental Compliance — RoHS-compliant construction to meet lead-free assembly requirements.

Typical Applications

  • Industrial Control — Control logic, sensor aggregation and protocol bridging using on-chip memory and abundant logic elements for deterministic real-time processing.
  • Wireless and Wireline Infrastructure — Baseband processing, packet handling and link interfacing that leverage integrated transceivers and hard memory controllers for high-throughput data paths.
  • Communications and Defense Systems — Mid-density signal processing and custom protocol implementations that require a mix of logic, embedded RAM and flexible I/O.

Unique Advantages

  • Balanced Integration: 50,000 logic elements and ~2.86 Mbits of embedded RAM provide a strong mix of logic and memory for mid-range FPGA designs, reducing the need for external SRAM in many use cases.
  • High I/O Flexibility: 240 I/O pins plus integrated transceiver and hard memory controller capabilities support diverse interface requirements and simplify system-level connectivity.
  • Low-Power Silicon: Built on a 28‑nm low‑power process with a 1.07–1.13 V core supply window, enabling efficient operation in power-sensitive commercial applications.
  • Compact, Surface-Mount Package: 484-FBGA (23 × 23) packaging enables dense board layouts while maintaining mechanical compatibility with standard SMT assembly flows.
  • Regulatory Readiness: RoHS compliance supports lead-free manufacturing and environmental requirements for commercial products.

Why Choose 5CGXBC4C6F23C7N?

This Cyclone V GX device offers a pragmatic combination of logic density, on-chip memory and a broad I/O set in a compact 484-FBGA package, making it well suited to commercial systems that require significant programmable logic and embedded RAM without moving to higher-cost device classes. The device’s 1.07–1.13 V supply window and commercial temperature rating align it with standard production environments.

Designers seeking a mid-density FPGA for industrial controls, communications infrastructure, or defense communications can leverage the Cyclone V architecture—featuring low-power process technology, embedded memory structures, and integrated transceiver/memory-controller capabilities—to simplify board-level design and accelerate time to market.

Request a quote or submit an inquiry for availability and pricing of 5CGXBC4C6F23C7N to evaluate this FPGA for your next design.

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