5CGXBC4C6F27C7N
| Part Description |
Cyclone® V GX Field Programmable Gate Array (FPGA) IC 336 2862080 50000 672-BGA |
|---|---|
| Quantity | 409 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BGA | Number of I/O | 336 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18868 | Number of Logic Elements/Cells | 50000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2862080 |
Overview of 5CGXBC4C6F27C7N – Cyclone® V GX Field Programmable Gate Array (FPGA) IC, 50,000 logic elements
The 5CGXBC4C6F27C7N is a Cyclone® V GX FPGA in a 672-FBGA (27 × 27 mm) surface-mount package. It combines a mid-range FPGA fabric with integrated transceiver-capable features and hard memory controller capabilities suitable for demanding I/O and memory-interfacing designs.
Targeted at applications that require a balance of logic capacity, embedded memory, and high I/O density, this commercial-grade device delivers a compact platform for wireless/wireline, industrial, and military system designs where power-efficient FPGA resources and robust I/O counts are required.
Key Features
- FPGA Fabric Approximately 50,000 logic elements provide flexible programmable logic for custom digital functions and mid-density system integration.
- Embedded Memory Approximately 2.86 Mbits of on-chip RAM to support buffering, frame storage, and local data processing.
- Enhanced ALM and DSP Capabilities Cyclone V architecture includes enhanced 8-input adaptive logic modules (ALMs) and variable-precision DSP structures for efficient implementation of arithmetic and signal-processing functions.
- High I/O Count 336 I/O pins provide a wide interface capability for parallel buses, sensors, memory interfaces, and peripheral connections.
- Integrated Transceiver and Memory IP (family-level) Cyclone V GX family devices are enhanced with integrated transceivers and hard memory controller support for high-bandwidth serial links and external memory interfaces.
- Power and Voltage Core supply operating range of 1.07 V to 1.13 V supports low-voltage operation consistent with Cyclone V device requirements.
- Package and Mounting 672-FBGA (27 × 27 mm) surface-mount package enables a compact board footprint and high-density routing for complex system boards.
- Operating Conditions Commercial temperature range of 0 °C to 85 °C and RoHS-compliant status for regulatory alignment.
Typical Applications
- Wireless and Wireline Communications Use the device’s transceiver-capable architecture and high I/O density for protocol bridging, packet processing, and interface adaptation.
- Industrial Control and Automation Leverage the FPGA fabric and embedded memory for motor control logic, deterministic I/O handling, and custom protocol implementation in automation equipment.
- Military and Aerospace Systems Employ the mid-density logic and extensive I/O to implement custom signal processing, sensor aggregation, and interface functions in mission equipment.
- Embedded System Integration Integrate the FPGA to offload custom logic tasks, create hardware accelerators, and manage complex I/O and memory interfaces on compact system boards.
Unique Advantages
- Balanced Logic and Memory Capacity: Approximately 50,000 logic elements paired with ~2.86 Mbits of embedded RAM deliver a balanced platform for control, signal processing, and buffering tasks.
- High I/O Density: 336 I/Os allow flexible interfacing to external devices, sensors, memories, and high-speed peripherals without compromising board layout.
- Compact, High-Density Package: The 672-FBGA (27 × 27 mm) package minimizes PCB area while enabling necessary routing for complex designs.
- Low-Voltage Core Operation: Narrow core voltage range (1.07–1.13 V) supports controlled power delivery and aligns with low-power system design practices.
- Commercial-Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS-compliant construction for mainstream electronics deployments.
Why Choose 5CGXBC4C6F27C7N?
The 5CGXBC4C6F27C7N delivers a mid-range Cyclone V GX FPGA platform that balances programmable logic, embedded memory, and extensive I/O in a compact 672-FBGA package. Its combination of approximately 50,000 logic elements, substantial on-chip RAM, and transceiver-capable Cyclone V GX architecture makes it well suited to applications that require flexible hardware acceleration, complex interfacing, and efficient board-level integration.
For teams looking to implement high-density I/O systems, custom protocol logic, or embedded processing accelerators on a commercial-grade FPGA, this device offers a verifiable specification set and the Cyclone V family features to support scalable development and deployment.
Request a quote or submit a pricing request to obtain availability and lead-time information for 5CGXBC4C6F27C7N.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018