5CGXBC4C7U19C8N
| Part Description |
Cyclone® V GX Field Programmable Gate Array (FPGA) IC 224 2862080 50000 484-FBGA |
|---|---|
| Quantity | 841 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-UBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA | Number of I/O | 224 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18868 | Number of Logic Elements/Cells | 50000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2862080 |
Overview of 5CGXBC4C7U19C8N – Cyclone V GX FPGA, 50,000 logic elements, 224 I/O, 484-FBGA
The 5CGXBC4C7U19C8N is an Intel Cyclone® V GX field-programmable gate array (FPGA) supplied in a 484-FBGA (484-UBGA, 19×19) surface-mount package. It combines mid-range programmable logic capacity with embedded memory and a broad I/O count to serve cost-sensitive, high-volume applications.
Targeted use cases include industrial systems, wireless and wireline infrastructure, and military-grade designs that require balanced logic density, on-chip RAM, and flexible I/O. The device leverages Cyclone V family architecture and core-level characteristics documented in the Cyclone V device overview.
Key Features
- Logic Capacity — 50,000 logic elements, supported by 18,868 adaptive logic modules (ALMs) for implementing control, datapath, and interface logic.
- Embedded Memory — Total on-chip RAM of 2,862,080 bits (approximately 2.86 Mbits), enabling local buffering, FIFOs, and small data stores without external memory.
- I/O and Package — 224 user I/O pins in a compact 484-FBGA (484-UBGA, 19×19) surface-mount package for dense board-level integration.
- Power and Core Voltage — Designed for a core supply in the range of 1.07 V to 1.13 V (nominal ~1.1 V), supporting low-voltage system designs.
- Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for typical commercial applications.
- Package & Mounting — Surface-mount 484-FBGA package for automated PCB assembly and compact system form factors.
- RoHS Compliance — Lead-free and RoHS-compliant for global manufacturing requirements.
Typical Applications
- Industrial Automation — Real-time control, sensor aggregation, and I/O bridging where moderate logic density and on-chip RAM reduce external components.
- Wireless & Wireline Infrastructure — Protocol handling, packet pre-processing, and interface glue logic that benefit from FPGA flexibility and abundant I/O.
- Defense and Military Systems — Board-level FPGA functions for signal conditioning, data routing, and custom processing within commercial temperature limits.
- Embedded Systems — Offload or accelerate custom algorithms and peripheral interfacing, leveraging the device’s logic and embedded memory resources.
Unique Advantages
- Balanced mid-range capacity: 50,000 logic elements provide a practical trade-off between integration and cost for many mainstream FPGA tasks.
- On-chip memory reduces BOM: Approximately 2.86 Mbits of embedded RAM lowers reliance on external memory for buffering and small data structures.
- High I/O count in compact package: 224 I/O in a 484-FBGA (19×19) footprint simplifies high-density board designs while keeping the PCB area modest.
- Low-voltage core operation: Specified 1.07–1.13 V supply supports low-power system designs and compatibility with modern power rails.
- Production-ready compliance: Commercial temperature grading and RoHS compliance align with standard manufacturing and regulatory requirements.
Why Choose 5CGXBC4C7U19C8N?
The 5CGXBC4C7U19C8N delivers a practical balance of programmable logic, embedded memory, and a high I/O count in a compact surface-mount FBGA package. It is well suited for engineers and procurement teams seeking a Cyclone V GX-class FPGA that supports mid-range system integration without excessive cost or board area.
This device fits designs that require reliable commercial-grade operation, lower core-voltage operation, and RoHS-compliant manufacturing. Its combination of logic elements, ALMs, and on-chip RAM offers designers the flexibility to implement control, interfacing, and data buffering on a single device.
Request a quote or submit an inquiry to get pricing and availability for 5CGXBC4C7U19C8N.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018