5CGXBC5C6U19C7N
| Part Description |
Cyclone® V GX Field Programmable Gate Array (FPGA) IC 224 5001216 77000 484-FBGA |
|---|---|
| Quantity | 456 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-UBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA | Number of I/O | 224 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 29080 | Number of Logic Elements/Cells | 77000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5001216 |
Overview of 5CGXBC5C6U19C7N – Cyclone® V GX FPGA, 484‑FBGA, 77,000 logic elements
The 5CGXBC5C6U19C7N is an Intel Cyclone® V GX field programmable gate array (FPGA) in a 484‑FBGA package. It delivers a high-density, low-power programmable fabric with abundant I/O and on-chip memory for embedded logic, interface bridging, and signal processing tasks.
Designed for commercial applications, this device combines approximately 77,000 logic elements, approximately 5.00 Mbits of embedded memory, and 224 I/O pins in a 19 × 19 484‑UBGA footprint. The device operates from a 1.07 V to 1.13 V core supply and is specified for 0 °C to 85 °C operation.
Key Features
- Core architecture — Cyclone V GX family device built on the Cyclone V platform with 1.1 V nominal core operation and a measured supply range of 1.07 V to 1.13 V.
- Logic capacity — Approximately 77,000 logic elements to implement complex control, glue logic, and FPGA-based processing.
- Embedded memory — Approximately 5.00 Mbits of on‑chip RAM for buffers, FIFOs, and local data storage.
- I/O and packaging — 224 general-purpose I/O pins in a surface‑mount 484‑FBGA (484‑UBGA, 19 × 19) package for high pin‑count board designs.
- Family-level integration features — Cyclone V devices include integrated transceivers and hard memory controller options as part of the family feature set, enabling higher bandwidth interfaces where required.
- Form factor & mounting — Surface mount 484‑FBGA package suitable for compact board layouts.
- Commercial grade & environmental — Specified for commercial operation (0 °C to 85 °C) and RoHS compliant.
Typical Applications
- Communications and interface bridging — Implement protocol adapters, parallel-to-serial bridges, and interface logic using the device’s logic density and family-level transceiver/memory-controller capabilities.
- Embedded control and housekeeping — Replace or augment microcontroller-based glue logic with programmable, high‑I/O control for board-level peripherals and sensor interfaces.
- Data buffering and aggregation — Use the on‑chip RAM and abundant I/O to buffer, packetize, or aggregate data streams between subsystems.
- Custom accelerators and signal processing — Leverage the logic capacity to implement deterministic, low-latency processing blocks and application-specific pipelines.
Unique Advantages
- Balanced density and I/O: Approximately 77,000 logic elements paired with 224 I/O pins provide a strong mix of gate count and connectivity for mid-range FPGA tasks.
- Compact 484‑FBGA footprint: The 19 × 19 484‑UBGA package supports high pin density while enabling compact PCB designs.
- Controlled core voltage window: Narrow 1.07 V to 1.13 V supply requirement simplifies power-rail design and monitoring for the FPGA core.
- Family-level system options: Cyclone V family capabilities such as integrated transceivers and hard memory controllers allow designers to scale up to higher-bandwidth interfaces when required by system architecture.
- Commercial-grade specification: Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.
- Surface-mount package for production: The BGA form factor supports automated assembly and reliable soldered connections for volume manufacturing.
Why Choose 5CGXBC5C6U19C7N?
The 5CGXBC5C6U19C7N delivers a practical balance of logic capacity, on‑chip memory, and I/O count in a compact 484‑FBGA package. As a Cyclone V GX family device from Intel, it brings family-level features—such as integrated transceivers and memory-controller options—into a commercial‑grade FPGA intended for mid-density, low-power programmable designs.
This device is well suited for engineers seeking a cost-effective, programmable building block for communications interfaces, embedded control, data buffering, and custom processing tasks where a compact package, significant I/O, and measured core voltage are required.
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