5CGXBC5C7F23C8N

The 5CGXBC5C7F23C8N is a Cyclone® V GX field programmable gate array (FPGA) in a 484-ball BGA package. It combines a high-density logic fabric—77,000 logic elements—with 240 I/O pins and on‑chip embedded memory to address mid-range FPGA applications.

Built on the Cyclone V family architecture, this commercial‑grade device targets cost- and power‑sensitive designs where integration and predictable supply‑voltage and thermal envelopes are important.

Key Features

• Logic Capacity — 77,000 logic elements for implementing complex control, protocol, and signal-processing logic.
• Embedded Memory — Approximately 4.77 Mbits of on-chip RAM (5,001,216 bits) for buffers, FIFOs, and local data storage. The Cyclone V family also includes devices with larger embedded memory options.
• I/O Density — 240 general-purpose I/O pins to interface with peripherals, memory, and high-speed connectors.
• Family-Level Integration — As a Cyclone V GX device, it benefits from the Cyclone V family architecture that includes integrated transceivers and hard memory controllers (family features documented in the Cyclone V device overview).
• Process and Core Voltage — Based on TSMC 28 nm low-power process technology with a specified supply range of 1.07 V to 1.13 V for the core (typical family core voltage documented as 1.1 V).
• Enhanced ALM Architecture — Cyclone V devices use an enhanced 8‑input adaptive logic module (ALM) structure (family feature), improving logic density and flexibility.
• Package and Mounting — 484‑FBGA (23×23) package, surface‑mount, suited for compact, board‑level integration.
• Operating Conditions — Commercial‑grade operating temperature range: 0 °C to 85 °C. RoHS compliant.

Typical Applications

• Embedded Control and Automation — Implement deterministic control logic, motor-control interfaces, and custom state machines using the device’s logic and I/O resources.
• Communication Endpoints — Use the Cyclone V GX family’s transceiver and protocol resources (family-level) to build wired or wireless interface endpoints and protocol gateways.
• Memory Interface and Buffering — Leverage on-chip RAM and the family’s hard memory controller features to implement buffering, packet queues, and external memory interfaces.
• Signal Processing and Acceleration — Map custom DSP or preprocessing engines into the FPGA fabric and embedded memory for offloading tasks from a host processor.

Unique Advantages

• High logic density in a compact package: 77,000 logic elements in a 484‑BGA footprint enable feature‑rich designs without a large PCB footprint.
• Integrated family features: Benefits from Cyclone V GX family capabilities such as integrated transceivers and hard memory controllers to reduce external IP and board complexity (family-level).
• Controlled power envelope: Narrow core supply range (1.07 V–1.13 V) and 28 nm low‑power family process provide predictable power planning for system designers.
• On‑chip memory for latency‑sensitive functions: Approximately 4.77 Mbits of embedded RAM supports local buffering and real‑time data handling without immediate external memory dependence.
• Commercial readiness and compliance: Surface‑mount 484‑FBGA packaging and RoHS compliance simplify manufacturing and regulatory adherence for mainstream products.

Why Choose 5CGXBC5C7F23C8N?

This Cyclone V GX FPGA balances substantial logic capacity and on‑chip memory with a compact, manufacturable package and clearly defined electrical and thermal parameters. It is well suited to engineers building mid-range embedded systems, communication endpoints, and custom acceleration blocks that require predictable power, a moderate I/O count, and family-level integration advantages.

Choosing 5CGXBC5C7F23C8N provides a pathway to scale within the Cyclone V family while leveraging documented family features—helpful for designs that may migrate across densities or require hard IP blocks available in the Cyclone V architecture.

Request a quote or submit an RFQ to check availability, pricing, and lead times for the 5CGXBC5C7F23C8N. Manufacturing and procurement teams can use the part number and package details to evaluate integration and BOM impacts.