5CGXBC7B7M15C8N

The 5CGXBC7B7M15C8N is an Intel Cyclone V GX FPGA in a 484‑LFBGA (15×15 mm) package. It delivers a high‑capacity, low‑power FPGA fabric with integrated transceivers and hard memory controller capabilities suitable for bandwidth‑sensitive embedded designs.

Designed on TSMC's 28‑nm low‑power (28LP) process, this device combines substantial logic and on‑chip memory with configurable I/O and a compact surface‑mount package, addressing applications that require integration, efficiency, and measurable logic density.

Key Features

• Logic Capacity — 149,500 logic elements (cells) to implement complex digital functions and state machines.
• Embedded Memory — Approximately 7.88 Mbits of on‑chip RAM (7,880,704 total RAM bits) for buffering, FIFOs, and local data storage.
• Logic Array Blocks — 56,480 LABs/CLBs reported for mapping fabric resources and partitioning designs.
• High‑Speed I/O — 240 general‑purpose I/O pins to interface with peripherals, memory, and custom I/O subsystems.
• Transceivers and Memory IP (series‑level) — Cyclone V family features include integrated transceivers and hard memory controllers; the family supports transceiver data rates noted in the device overview.
• Low‑Power Process and Core Voltage — Built on 28‑nm low‑power technology with a 1.1 V core; this part specifies a supply range of 1.07 V to 1.13 V.
• Package and Mounting — Surface‑mount 484‑LFBGA (484‑MBGA, 15×15 mm) for compact board integration.
• Commercial Temperature Range — Specified operating temperature from 0 °C to 85 °C for typical commercial applications.
• RoHS Compliant — Meets RoHS requirements for lead‑free manufacturing processes.

Typical Applications

• Wireless and Wireline Infrastructure — Use the device’s high logic capacity and family transceiver options to implement protocol processing, packet buffering, and custom forwarding logic.
• Communications Equipment — Leverage the on‑chip RAM and abundant I/O to build interface controllers, frame processing, and timing/data path acceleration.
• Military and Aerospace Systems — Employ the device’s logic density and integration potential for embedded signal processing and control functions where commercial temperature operation is acceptable.
• Embedded SoC Prototyping — Use the Cyclone V GX device to evaluate and prototype high‑bandwidth logic and memory interfaces in compact PCB designs.

Unique Advantages

• High Logic Density: 149,500 logic elements enable large FPGA designs without external logic expansion.
• Substantial On‑Chip Memory: Approximately 7.88 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Broad I/O Count: 240 I/O pins provide flexible connectivity for parallel interfaces, memory buses, and mixed signaling domains.
• Low‑Power Process Technology: 28‑nm low‑power construction and a narrow core voltage supply support energy‑efficient implementations.
• Compact Package: 484‑LFBGA (15×15 mm) balances footprint and thermal characteristics for dense board designs.
• Standards‑Aware Manufacturing: RoHS compliance supports lead‑free assembly flows.

Why Choose 5CGXBC7B7M15C8N?

The 5CGXBC7B7M15C8N places a large logic fabric, significant embedded memory, and a high I/O count into a compact 484‑LFBGA package built on a 28‑nm low‑power process. It is well suited for designers who need a balance of logic capacity, on‑chip memory, and transceiver/memory IP capability within commercial temperature operating bounds.

This Cyclone V GX device is appropriate for teams building bandwidth‑sensitive embedded systems, communications interfaces, and prototype platforms that require measurable logic density combined with low‑power characteristics and RoHS‑compatible packaging.

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