5CGXBC5C7U19C8N
| Part Description |
Cyclone® V GX Field Programmable Gate Array (FPGA) IC 224 5001216 77000 484-FBGA |
|---|---|
| Quantity | 239 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-UBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA | Number of I/O | 224 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 29080 | Number of Logic Elements/Cells | 77000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5001216 |
Overview of 5CGXBC5C7U19C8N – Cyclone® V GX FPGA, 224 I/O, ~5.00 Mbits, 77,000 logic elements, 484-FBGA
The 5CGXBC5C7U19C8N is an Intel Cyclone V GX field-programmable gate array (FPGA) in a 484-FBGA (484-UBGA 19×19) package. It provides a high-density, low-power FPGA fabric with integrated connectivity and memory resources suited for communication and embedded logic applications.
Key value comes from its combination of approximately 77,000 logic elements, about 5.00 Mbits of embedded memory, and 224 user I/O pins, delivered in a surface-mount commercial-grade package optimized for compact, high-function designs.
Key Features
- Logic Capacity Approximately 77,000 logic elements for implementing complex combinational and sequential logic functions.
- On-chip Memory Approximately 5.00 Mbits of embedded RAM for buffering, FIFOs, and small memory-mapped storage.
- I/O Density 224 general-purpose I/O pins to support a wide range of parallel interfaces and external peripherals.
- Process and Core Voltage Built on a low-power 28 nm process with device supply around 1.1 V (specified 1.07 V to 1.13 V).
- Integrated Connectivity and IP (Cyclone V GX family) Cyclone V GX devices include integrated transceivers and hard memory controller options at the family level to simplify high-speed and external-memory interfaces.
- Package & Mounting 484-FBGA (supplier package 484-UBGA, 19×19) in a surface-mount form factor for compact PCB designs.
- Commercial Temperature Range Rated for 0 °C to 85 °C operation, suitable for commercial applications.
- Compliance RoHS‑compliant manufacturing.
Typical Applications
- Communications & Networking Use the device's fabric and family-level connectivity features to implement packet processing, protocol bridging, or PHY interface logic.
- Embedded Systems & SoC Integration High logic and RAM capacity make this FPGA suitable for combining control logic, peripheral interfacing, and accelerators in embedded designs.
- Digital Signal Processing On-chip memory and the Cyclone V family’s DSP capabilities are appropriate for fixed- and variable-precision signal processing tasks.
- External Memory Interfaces Leverage family-level hard memory controller features to build designs that require robust external memory access and buffering.
Unique Advantages
- High integration in a compact package: 77,000 logic elements and 224 I/Os in a 484-FBGA provide a dense implementation platform while keeping board area low.
- On-chip memory for system efficiency: Approximately 5.00 Mbits of embedded RAM reduces reliance on external memory for mid-sized buffering and storage needs.
- Low-voltage operation: Device supply specified between 1.07 V and 1.13 V aligns with low-power system designs and a 1.1 V core voltage.
- Surface-mount package for modern PCBs: 484-UBGA (19×19) surface-mount footprint supports automated assembly and dense board layouts.
- Commercial-grade suitability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product lines.
Why Choose 5CGXBC5C7U19C8N?
The 5CGXBC5C7U19C8N delivers a balance of logic density, embedded memory, and I/O capacity in a compact FBGA package, making it a practical choice for communication, embedded control, and DSP-focused designs that require on-chip resources and flexible interfacing. Its low-voltage operation and family-level connectivity features provide designers with a route to efficient, integrated systems without excessive external components.
This part is appropriate for commercial applications where a robust combination of logic capacity, embedded RAM, and I/O density is required, and where Intel’s Cyclone V GX family features (such as integrated transceivers and hard memory controllers at the family level) can simplify system architecture and reduce bill-of-materials complexity.
If you would like pricing, lead-time, or availability, request a quote or submit a procurement inquiry to receive specific ordering and fulfillment information for part number 5CGXBC5C7U19C8N.

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