5CGXBC7C6F23C7N

The 5CGXBC7C6F23C7N is an Intel Cyclone V GX field-programmable gate array available in a 484-ball BGA package. It combines a high-density logic fabric with substantial on-chip memory and a commercial operating range to address cost-sensitive, mid-to-high complexity embedded designs.

Designed for applications that demand flexible hardware acceleration, moderate embedded memory, and a compact surface-mount package, this device targets industrial, communications, and general-purpose embedded systems where integration, power efficiency, and I/O capacity matter.

Key Features

• Process and Core — Built on TSMC 28 nm low-power process technology with a nominal core supply range of 1.07 V to 1.13 V, matching Cyclone V family low-voltage operation.
• Logic Capacity — 149,500 logic elements for implementing sizable custom logic, control, and glue-logic functions on a single device.
• Embedded Memory — Approximately 7.88 Mbits of embedded memory to support frame buffers, FIFOs, and on-chip data storage.
• I/O and Package — 240 user I/O pins in a 484-FBGA (23 × 23) surface-mount package, providing a balanced mix of signal connectivity in a compact footprint.
• Integrated FPGA Architecture (Family) — Cyclone V family features such as enhanced 8‑input adaptive logic modules and variable‑precision DSP blocks are part of the device architecture as defined for Cyclone V GX devices.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial environments.
• Regulatory — RoHS-compliant construction to meet common environmental requirements.

Typical Applications

• Industrial Control — Implement motor control logic, sensor aggregation, and deterministic control tasks using on-chip logic and embedded memory.
• Communications and Networking — Use the Cyclone V GX family architecture for packet processing, protocol bridging, and I/O aggregation in mid-range networking equipment.
• Embedded Processing — Accelerate custom algorithms and offload compute-intensive functions from a host processor using programmable logic and embedded memory.
• Prototyping and System Integration — Rapidly prototype system logic, interface bridging, and custom peripherals in a compact BGA package suitable for production hardware.

Unique Advantages

• Significant logic density: 149,500 logic elements enable consolidation of multiple functions and reduce component count in system designs.
• Dedicated embedded memory: Approximately 7.88 Mbits of on-chip RAM supports local buffering and state storage without external memory in many use cases.
• Compact, production-ready package: 484-FBGA (23 × 23) surface-mount package delivers high I/O count in a compact footprint for space-constrained boards.
• Low-voltage core operation: Narrow core supply range (1.07 V–1.13 V) aligns with low-power system designs and predictable power budgeting.
• Commercial temperature and regulatory compliance: 0 °C–85 °C rating and RoHS compliance simplify qualification for standard commercial products.

Why Choose 5CGXBC7C6F23C7N?

The 5CGXBC7C6F23C7N offers a balanced combination of logic density, embedded memory, and I/O availability in a compact 484-BGA package, making it suitable for developers who need to consolidate functions and accelerate tasks within a single FPGA. Its Cyclone V GX architecture and low-voltage core operation provide a predictable platform for mid-complexity embedded systems where power, integration, and production-ready packaging are priorities.

This part is ideal for engineering teams building commercial-grade products that require on-chip memory capacity, substantial programmable logic resources, and a high pin-count BGA footprint. The device’s RoHS compliance and standard temperature rating support straightforward productization and deployment in cost-sensitive markets.

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