5CGXBC7D6F27C7N
| Part Description |
Cyclone® V GX Field Programmable Gate Array (FPGA) IC 336 7880704 149500 672-BGA |
|---|---|
| Quantity | 737 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BGA | Number of I/O | 336 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56480 | Number of Logic Elements/Cells | 149500 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7880704 |
Overview of 5CGXBC7D6F27C7N – Cyclone® V GX FPGA, 672‑BGA, 336 I/O
The 5CGXBC7D6F27C7N is an Intel Cyclone® V GX field-programmable gate array (FPGA) supplied in a 672‑BGA package. It provides a large programmable fabric—149,500 logic elements—with integrated memory and I/O to address bandwidth-sensitive and embedded processing applications.
Series-level features described in the Cyclone V device overview include low-power 28 nm process technology, integrated transceivers and hard memory controllers, and a 1.1 V core operating point. The device ships as a commercial-grade, surface-mount FPGA with a core supply window of 1.07 V to 1.13 V and an operating temperature range of 0 °C to 85 °C.
Key Features
- Logic Capacity 149,500 logic elements for implementing complex digital logic and system functions.
- Embedded Memory Approximately 7.88 Mbits of on-chip RAM to support buffering, FIFOs, and local storage.
- I/O Resources 336 I/O pins, providing broad external connectivity for interfaces and peripherals.
- Power and Core Voltage Core supply range from 1.07 V to 1.13 V; Cyclone V series documentation references a 1.1 V core operating point.
- Package and Mounting 672‑BGA (supplier package: 672‑FBGA, 27×27) in a surface-mount form factor for compact board integration.
- Temperature and Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Series-Level Integration Cyclone V GX devices include integrated transceivers and hard memory controllers as described in the device overview, enabling higher bandwidth interfaces and memory subsystem integration.
- RoHS Compliant Environmentally compliant for common manufacturing requirements.
Typical Applications
- High-bandwidth communications Use the device’s GX family transceiver and abundant logic to implement protocol bridging, packet processing, and PHY interfacing.
- Embedded acceleration Leverage the large logic fabric and on-chip memory for data-path acceleration, custom DSP, and hardware offload functions.
- Memory-interfacing systems Integrate hard memory controllers and internal RAM to create efficient external memory interfaces and buffering subsystems.
- Custom control and interface hubs Combine plentiful I/O and programmable logic to consolidate multiple peripheral interfaces and control logic on a single device.
Unique Advantages
- Large programmable fabric: 149,500 logic elements support complex SoC-style implementations and high-density glue logic.
- Significant on-chip RAM: Approximately 7.88 Mbits of embedded memory reduces reliance on external memory for many buffering and local-storage tasks.
- Broad external connectivity: 336 I/O pins and GX-series transceiver capability enable multiple high-speed and general-purpose interfaces.
- Compact, industry-standard packaging: 672‑BGA (27×27) provides a high I/O count in a compact surface-mount footprint for space-constrained PCBs.
- Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant to meet typical commercial manufacturing and environmental requirements.
- Designed for low-power operation: Series-level 28 nm low-power process and a narrow core voltage window support efficient system-level power management.
Why Choose 5CGXBC7D6F27C7N?
The 5CGXBC7D6F27C7N targets designs that require a large, flexible FPGA fabric combined with substantial on-chip RAM and broad I/O. Its Cyclone V GX‑family attributes—integrated transceivers, hard memory controllers, and a low-voltage 28 nm process—make it well suited to bandwidth-focused and embedded-acceleration applications where integration and power-conscious design matter.
Engineers and procurement teams looking for a commercially rated, RoHS‑compliant FPGA with a compact 672‑BGA footprint, 336 I/O, and 149,500 logic elements will find this part appropriate for consolidating interfaces, implementing custom accelerators, and building high-bandwidth subsystems within the Cyclone V ecosystem.
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