5CGXBC9A6U19C7N

The 5CGXBC9A6U19C7N is an Intel Cyclone® V GX field-programmable gate array (FPGA) supplied in a 484-FBGA (484-UBGA, 19×19) package. It delivers a high-density programmable fabric with 301,000 logic elements, approximately 14.25 Mbits of embedded memory, and 240 user I/Os for designs that require significant logic capacity and I/O integration.

Built on the Cyclone V family architecture and specified for commercial operation, this device targets applications in industrial, wireless and wireline communications, and military systems where integrated transceivers, hard memory controllers, and high I/O count are valuable.

Key Features

• Logic Capacity — 301,000 logic elements to implement complex programmable logic and control functions.
• Embedded Memory — Approximately 14.25 Mbits of on-chip RAM for buffering, packet processing, or lookup tables.
• I/O Density — 240 user I/Os for extensive external interfacing and high-pin-count system designs.
• Process and Core Voltage — Based on the Cyclone V family architecture with core voltage supply specified at 1.07 V to 1.13 V.
• Package and Mounting — 484-FBGA (supplier package 484-UBGA, 19×19) in a surface-mount format for compact PCB integration.
• Operating Range — Commercial grade operation from 0 °C to 85 °C.
• Standards and Compliance — RoHS-compliant.
• Family-level Integration — Cyclone V series features such as enhanced adaptive logic modules and embedded memory configurations are part of the device family architecture.

Typical Applications

• Wireless Infrastructure — FPGA fabric, embedded memory, and integrated transceiver capabilities support high-bandwidth signal processing and data movement in wireless equipment.
• Wireline Communications — High logic density and large I/O count enable protocol processing, packet handling, and interface bridging in wireline systems.
• Industrial Systems — Large logic and memory resources provide flexibility for control, automation, and data-acquisition functions in industrial equipment.
• Military and Aerospace — The device’s logic capacity, embedded memory, and I/O resources make it suitable for communication and processing subsystems in mission-critical designs.

Unique Advantages

• High logic density: 301,000 logic elements let you consolidate multiple functions into a single FPGA, reducing system complexity.
• Substantial on-chip RAM: Approximately 14.25 Mbits of embedded memory supports buffering, packet queues, and LUT-heavy implementations without immediate reliance on external memory.
• Wide I/O connectivity: 240 I/Os provide flexibility for multiple parallel interfaces, high-speed buses, and mixed-signal front ends.
• Low core-voltage operation: Specified 1.07 V to 1.13 V core supply aligns with low-power design goals for board-level power budgeting.
• Compact surface-mount package: 484-FBGA (484-UBGA, 19×19) provides a high-pin-count footprint in a compact assembly format for dense PCB layouts.
• RoHS compliance: Meets common environmental standards for lead-free assembly and regulatory adherence.

Why Choose 5CGXBC9A6U19C7N?

This Cyclone V GX device combines a high logic-element count, large embedded memory, and extensive I/O in a compact 484-FBGA package, making it well suited for designs that require significant on-chip resources and connectivity. As a member of the Cyclone V family from Intel, it leverages family-level architectural features for migration across device densities and integration options.

Choose 5CGXBC9A6U19C7N for projects that demand high programmable logic capacity, substantial on-chip RAM, and a high I/O pin count within a commercial temperature range and surface-mount package. Its specifications support scalable designs where integration and board-level footprint are key considerations.

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