5CGXBC7D7F31C8N

The 5CGXBC7D7F31C8N is an Intel Cyclone® V GX FPGA in an 896‑FBGA (31×31) package offering high logic capacity and extensive I/O for cost‑sensitive, high‑bandwidth designs. It combines a large programmable fabric with integrated transceiver and memory controller capabilities found in the Cyclone V family, delivering a balance of logic density, embedded memory, and I/O for communications and embedded processing applications.

Key electrical and environmental characteristics include a core supply range of 1.07 V to 1.13 V, commercial operating temperature from 0 °C to 85 °C, surface‑mount packaging, and RoHS compliance.

Key Features

• Logic Capacity — 149,500 logic elements to implement complex custom logic and control functions.
• Embedded Memory — Approximately 7.88 Mbits of on‑chip RAM (total RAM bits: 7,880,704) for buffering, state storage, and local data handling.
• I/O Density — 480 general‑purpose I/O pins to support wide external interfacing and board‑level connectivity.
• Package & Mounting — 896‑FBGA (31×31) supplier device package / 896‑BGA package case designed for surface‑mount assembly.
• Power — Narrow core voltage range (1.07 V to 1.13 V) for predictable power budgeting in system design.
• Operating Range & Grade — Commercial grade operation from 0 °C to 85 °C, suitable for standard commercial environments.
• RoHS Compliance — Meets RoHS environmental requirements.
• Cyclone V Family Capabilities — Part of the Cyclone V family, which includes devices enhanced with integrated transceivers and hard memory controllers to address high‑bandwidth and cost‑sensitive applications.

Typical Applications

• Wireless and Wireline Communications — Use the device’s logic density, embedded memory, and integrated transceiver support for protocol processing, framing, and interface bridging.
• Embedded SoC and Control — Implement complex control logic and local buffering where significant programmable logic and on‑chip RAM are required.
• High‑Bandwidth Data Processing — Leverage the large logic fabric and RAM for streaming data tasks such as packet processing, buffering, and reformatting.
• Board‑level Interface Aggregation — 480 I/O pins enable consolidation of multiple peripheral interfaces and high‑pin‑count connectivity on a single FPGA.

Unique Advantages

• High Logic Density: 149,500 logic elements enable implementation of large, complex designs without external ASICs.
• Substantial On‑Chip RAM: Approximately 7.88 Mbits of embedded memory reduces dependence on external memory for many buffering and state‑storage tasks.
• Extensive I/O Count: 480 I/O pins provide flexible connectivity for multi‑interface systems and board consolidation.
• Compact, Surface‑Mount Package: 896‑FBGA (31×31) supports high‑density PCB layouts while maintaining robust soldered attachment.
• Predictable Power Window: A defined core supply range (1.07 V–1.13 V) simplifies power‑supply design and validation.
• Part of a Scalable Family: As a Cyclone V device, it aligns with family features such as integrated transceivers and hard memory controllers for easier design migration within the series.

Why Choose 5CGXBC7D7F31C8N?

The 5CGXBC7D7F31C8N positions itself as a high‑capacity Cyclone V GX FPGA option for designers who need substantial programmable logic, generous embedded memory, and a large I/O count in a commercial‑grade surface‑mount package. Its measured electrical characteristics and RoHS compliance make it suitable for mainstream embedded, communications, and data‑processing applications where predictable power and thermal behavior are required.

Designed within the Cyclone V family, this device offers migration and scalability benefits across device densities and package footprints, enabling longer‑term design flexibility within the Intel FPGA ecosystem.

If you would like pricing, lead‑time, or to request a formal quote for the 5CGXBC7D7F31C8N, submit a procurement inquiry to receive current availability and purchasing information.