5CGXBC9C6F23C7N

The 5CGXBC9C6F23C7N is a Cyclone® V GX Field Programmable Gate Array (FPGA) in a 484-BGA package optimized for cost-sensitive, high-density designs. Based on the Cyclone V architecture, this device combines a high logic capacity with substantial on-chip memory and a large I/O count for complex interface and processing tasks.

Typical use cases include high-bandwidth communications and embedded systems where a balance of logic resources, embedded memory, and package I/O density is required. The device targets applications that demand efficient power characteristics and system-level integration afforded by the Cyclone V family.

Key Features

• Logic Capacity  Provides 301,000 logic elements for implementing complex digital designs and large-scale logic functions.
• Embedded Memory  Approximately 14.25 Mbits of on-chip RAM (14,251,008 total RAM bits) to support buffering, FIFOs, and embedded data storage.
• I/O and Package  224 user I/O pins in a 484-BGA footprint; supplier package specified as 484-FBGA (23×23) and surface-mount mounting.
• Power and Core Voltage  Operates with a supply range of 1.07 V to 1.13 V, consistent with low-voltage FPGA core requirements.
• Operating Range and Grade  Commercial-grade device rated for 0 °C to 85 °C ambient operation and RoHS compliant.
• Cyclone V Architecture  Leverages Cyclone V family design characteristics—including 28 nm low-power process and enhanced logic modules—to deliver efficient logic integration and lower power operation.
• System-Level Integration (Family)  Cyclone V devices are enhanced with integrated transceivers and hard memory controllers at the family level, supporting common high-bandwidth interface needs.

Typical Applications

• High-Bandwidth Communications  Use the device’s abundant I/O and Cyclone V family transceiver/memory controller support to implement protocol bridging, packet processing, and interface logic for wireless and wireline systems.
• Embedded SoC and Acceleration  Deploy the large logic capacity and on-chip memory to accelerate compute-heavy functions, hardware offload, and custom coprocessing tasks within embedded platforms.
• Video and Imaging Pipelines  Leverage the combination of logic elements and embedded RAM for frame buffering, real-time image processing, and data formatting engines.
• Protocol and Interface Gateways  Implement multi-standard I/O conversion, protocol aggregation, and timing-critical interface control using the device’s I/O density and Cyclone V architecture.

Unique Advantages

• High integration in a compact package: The 484-BGA (23×23) package delivers substantial logic and memory capacity with 224 I/O in a surface-mount form factor suitable for dense board designs.
• Large on-chip memory footprint: Approximately 14.25 Mbits of embedded RAM reduces external memory dependence for buffering and intermediate storage.
• Strong logic resource pool: 301,000 logic elements enable complex finite-state machines, datapaths, and custom accelerators without immediate need for higher-density families.
• Low-voltage core operation: Narrow supply window (1.07 V–1.13 V) aligns with modern low-power FPGA core requirements for consistent power design.
• Commercial temperature rating: Rated 0 °C–85 °C for standard commercial deployments and production environments.
• RoHS compliant: Environmentally compliant manufacturing and assembly compatibility.

Why Choose 5CGXBC9C6F23C7N?

The 5CGXBC9C6F23C7N offers a balanced combination of high logic density, substantial embedded memory, and plentiful I/O in a compact 484-BGA package—making it suitable for designs that require substantial on-chip resources without moving to larger or more expensive device families. Its Cyclone V architecture foundation provides efficient logic elements and family-level integration features that streamline implementation of high-throughput interfaces and embedded processing blocks.

This device is well suited to engineers developing cost- and power-conscious communications, embedded compute, and interface gateway products who value a predictable commercial temperature range and RoHS-compliant manufacturing.

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