5CGXBC9D7F27C8N

IC FPGA 336 I/O 672FBGA
Part Description

Cyclone® V GX Field Programmable Gate Array (FPGA) IC 336 14251008 301000 672-BGA

Quantity 1,486 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BGANumber of I/O336Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs113560Number of Logic Elements/Cells301000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits14251008

Overview of 5CGXBC9D7F27C8N – Cyclone V GX FPGA IC, 336 I/O, 301,000 Logic Elements, 672-BGA

The 5CGXBC9D7F27C8N is an Intel Cyclone® V GX field-programmable gate array (FPGA) in a 672-ball BGA package designed for mid-density, low-power system integration. Based on the Cyclone V architecture, this device combines configurable logic, substantial embedded memory, on-chip transceivers and hard memory controller IP to address industrial, wireless/wireline and military applications that require a balanced mix of logic capacity and interfacing bandwidth.

With a core voltage around 1.1 V and a narrow supply range of 1.07 V to 1.13 V, this commercial-grade part targets designs that prioritize power efficiency and compact packaging while providing flexible I/O and embedded processing options available across the Cyclone V family.

Key Features

  • Configurable Logic — 301,000 logic elements and approximately 113,560 configurable logic blocks (CLBs) provide substantial fabric capacity for custom HDL implementations and glue logic.
  • Embedded Memory — Approximately 13.6 Mbits of on-chip RAM (total RAM bits: 14,251,008) for FIFOs, buffers and local storage of working datasets.
  • I/O and Packaging — 336 general-purpose I/O pins in a compact 672-BGA package (supplier package: 672-FBGA, 27 × 27 mm) for dense board-level integration.
  • Transceiver and System IP — Cyclone V GX series devices include integrated transceivers and hard memory controller IP; the Cyclone V family supports features such as PCIe hard IP and external memory interfaces as part of the series architecture.
  • Process and Core Voltage — Built on TSMC's 28 nm low-power (28LP) process with a nominal 1.1 V core operating point; this device specifies an allowed supply range of 1.07 V to 1.13 V.
  • Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental adherence.
  • SoC Integration Options — Cyclone V family devices include options for a hard processor system (HPS) with an integrated Arm Cortex-A9 MPCore processor in applicable variants, enabling tight processor–FPGA integration where required by the system architecture.

Typical Applications

  • Industrial Automation — Motor control, sensor aggregation and machine I/O where a mix of logic, embedded memory and flexible I/O is needed for control and deterministic processing.
  • Wireless and Wireline Infrastructure — PHY and protocol processing, line-rate interfacing and data-path buffering that leverage on-chip transceivers and hard memory controllers in the Cyclone V family.
  • Defense and Military Systems — Signal processing and communications functions that require a combination of configurable logic capacity and embedded memory within a commercial-grade FPGA platform where specified.
  • SoC and Embedded Processing — Designs that benefit from Cyclone V family HPS integration or require local FPGA acceleration alongside an external processor subsystem.

Unique Advantages

  • Highly integrated FPGA fabric: 301,000 logic elements and 113,560 CLBs provide the programmable capacity to consolidate multiple discrete functions into a single device.
  • Substantial on-chip memory: Approximately 13.6 Mbits of embedded memory reduces reliance on external RAM for common buffering and temporary storage tasks.
  • Balanced I/O and compact footprint: 336 I/O pins in a 672-FBGA (27 × 27 mm) package enable dense board layouts without sacrificing connectivity.
  • Low-voltage operation: Narrow supply window centered at 1.1 V (1.07–1.13 V) supports power-optimized system designs.
  • Series-level IP and transceivers: Cyclone V GX architecture includes hard memory controllers and serial transceiver capabilities, enabling higher-bandwidth interfaces and simplified external memory connectivity in qualifying system designs.
  • RoHS-compliant commercial part: Facilitates environmentally compliant procurement and assembly processes for commercial products.

Why Choose 5CGXBC9D7F27C8N?

This Cyclone V GX device balances logic density, embedded memory and I/O capability in a compact, low-voltage package suited for applications that require efficient integration of configurable logic and high-bandwidth interfaces. It is positioned for designers who need the Cyclone V family’s combination of on-chip memory, transceiver and hard-IP features without moving to higher-density or different-package variants.

Choose the 5CGXBC9D7F27C8N when you need a mid-density FPGA platform with migration-friendly package footprints, robust logic and memory resources, and commercial-grade operating parameters to support development across industrial, wireless/wireline and defense-related projects.

Request a quote or submit a procurement inquiry to start integrating the 5CGXBC9D7F27C8N into your design and evaluate availability, pricing and lead times.

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