5CGXBC9E7F31C8N

IC FPGA 480 I/O 896FBGA
Part Description

Cyclone® V GX Field Programmable Gate Array (FPGA) IC 480 14251008 301000 896-BGA

Quantity 1,395 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BGANumber of I/O480Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs113560Number of Logic Elements/Cells301000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits14251008

Overview of 5CGXBC9E7F31C8N – Cyclone V GX FPGA, 896-BGA

The 5CGXBC9E7F31C8N is a Cyclone® V GX field programmable gate array (FPGA) in an 896-ball BGA (31 × 31) package. It combines a high logic capacity FPGA fabric with integrated transceivers and hard memory controller capabilities, targeting cost- and power-sensitive designs that require moderate to high bandwidth and on-chip memory.

Designed for high-volume, cost-sensitive applications in markets such as industrial, wireless and wireline, and military, this device emphasizes power efficiency, system integration, and on-board memory and I/O density to accelerate time-to-market.

Key Features

  • Logic Capacity — 301,000 logic elements for implementing complex digital functions and custom accelerators.
  • Embedded Memory — Approximately 13.59 Mbits of on-chip RAM (14,251,008 total RAM bits) to support buffering, packet processing, and algorithmic state.
  • I/O Density — 480 user I/O pins to support wide external interfaces and high pin-count connectivity.
  • Transceivers and Memory IP — Series-level integration includes high-speed transceivers and hard memory controllers to simplify external memory and serial link implementations.
  • Process and Power — Built on a low-power process with a nominal core supply voltage range of 1.07 V to 1.13 V to support energy-efficient designs.
  • Packaging — 896-ball FBGA (31 × 31) surface-mount package for compact board integration and high-density routing.
  • Operating Range — Commercial grade operation from 0 °C to 85 °C for standard industrial and commercial applications.
  • Compliance — RoHS compliant to meet common environmental requirements.

Typical Applications

  • Wireless and Wireline Infrastructure — Use the on-chip transceivers and embedded memory for baseband processing, fronthaul/backhaul links, and packet buffering.
  • Industrial Systems — Implement real-time control, sensor aggregation, and deterministic I/O interfacing using the device’s large logic fabric and 480 I/O pins.
  • Networking and Data Aggregation — Leverage embedded memory and hard memory controllers for packet buffering, queue management, and protocol bridging.
  • Security and Signal Processing — Deploy custom accelerators and DSP workflows within the 301,000 logic elements and sizable on-chip RAM.

Unique Advantages

  • High logic plus on-chip memory: 301,000 logic elements combined with approximately 13.59 Mbits of RAM enable implementation of complex functions and local buffering without immediate reliance on external memory.
  • Integrated I/O and transceivers: 480 I/O pins and family-level transceiver support reduce external component count for high-bandwidth links and simplify board-level design.
  • Low-voltage operation: Narrow core voltage range (1.07 V–1.13 V) supports efficient power delivery and predictable power budgeting for system designs.
  • Compact, high-density packaging: 896-ball FBGA (31 × 31) allows dense PCB routing while maintaining a surface-mount footprint suitable for space-constrained systems.
  • Commercial temperature rating: 0 °C to 85 °C operation matches common commercial and many industrial deployment scenarios.
  • RoHS compliant: Meets environmental sustainability requirements for modern supply chains.

Why Choose 5CGXBC9E7F31C8N?

The 5CGXBC9E7F31C8N positions itself as a balanced solution for designers needing substantial logic density, generous embedded memory, and broad I/O in a compact BGA package. Its Cyclone V GX family characteristics—integrated transceivers and hard memory controller capabilities—help reduce BOM complexity while enabling higher bandwidth system architectures.

This device is well suited for engineering teams building cost- and power-conscious systems in industrial, wireless/wireline, and other commercial markets that require scalable FPGA resources and robust on-chip memory and I/O integration.

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