5CGXBC9E7F31C8N
| Part Description |
Cyclone® V GX Field Programmable Gate Array (FPGA) IC 480 14251008 301000 896-BGA |
|---|---|
| Quantity | 1,395 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 480 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 113560 | Number of Logic Elements/Cells | 301000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 14251008 |
Overview of 5CGXBC9E7F31C8N – Cyclone V GX FPGA, 896-BGA
The 5CGXBC9E7F31C8N is a Cyclone® V GX field programmable gate array (FPGA) in an 896-ball BGA (31 × 31) package. It combines a high logic capacity FPGA fabric with integrated transceivers and hard memory controller capabilities, targeting cost- and power-sensitive designs that require moderate to high bandwidth and on-chip memory.
Designed for high-volume, cost-sensitive applications in markets such as industrial, wireless and wireline, and military, this device emphasizes power efficiency, system integration, and on-board memory and I/O density to accelerate time-to-market.
Key Features
- Logic Capacity — 301,000 logic elements for implementing complex digital functions and custom accelerators.
- Embedded Memory — Approximately 13.59 Mbits of on-chip RAM (14,251,008 total RAM bits) to support buffering, packet processing, and algorithmic state.
- I/O Density — 480 user I/O pins to support wide external interfaces and high pin-count connectivity.
- Transceivers and Memory IP — Series-level integration includes high-speed transceivers and hard memory controllers to simplify external memory and serial link implementations.
- Process and Power — Built on a low-power process with a nominal core supply voltage range of 1.07 V to 1.13 V to support energy-efficient designs.
- Packaging — 896-ball FBGA (31 × 31) surface-mount package for compact board integration and high-density routing.
- Operating Range — Commercial grade operation from 0 °C to 85 °C for standard industrial and commercial applications.
- Compliance — RoHS compliant to meet common environmental requirements.
Typical Applications
- Wireless and Wireline Infrastructure — Use the on-chip transceivers and embedded memory for baseband processing, fronthaul/backhaul links, and packet buffering.
- Industrial Systems — Implement real-time control, sensor aggregation, and deterministic I/O interfacing using the device’s large logic fabric and 480 I/O pins.
- Networking and Data Aggregation — Leverage embedded memory and hard memory controllers for packet buffering, queue management, and protocol bridging.
- Security and Signal Processing — Deploy custom accelerators and DSP workflows within the 301,000 logic elements and sizable on-chip RAM.
Unique Advantages
- High logic plus on-chip memory: 301,000 logic elements combined with approximately 13.59 Mbits of RAM enable implementation of complex functions and local buffering without immediate reliance on external memory.
- Integrated I/O and transceivers: 480 I/O pins and family-level transceiver support reduce external component count for high-bandwidth links and simplify board-level design.
- Low-voltage operation: Narrow core voltage range (1.07 V–1.13 V) supports efficient power delivery and predictable power budgeting for system designs.
- Compact, high-density packaging: 896-ball FBGA (31 × 31) allows dense PCB routing while maintaining a surface-mount footprint suitable for space-constrained systems.
- Commercial temperature rating: 0 °C to 85 °C operation matches common commercial and many industrial deployment scenarios.
- RoHS compliant: Meets environmental sustainability requirements for modern supply chains.
Why Choose 5CGXBC9E7F31C8N?
The 5CGXBC9E7F31C8N positions itself as a balanced solution for designers needing substantial logic density, generous embedded memory, and broad I/O in a compact BGA package. Its Cyclone V GX family characteristics—integrated transceivers and hard memory controller capabilities—help reduce BOM complexity while enabling higher bandwidth system architectures.
This device is well suited for engineering teams building cost- and power-conscious systems in industrial, wireless/wireline, and other commercial markets that require scalable FPGA resources and robust on-chip memory and I/O integration.
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