5CGXFC3B6F23I7

The 5CGXFC3B6F23I7 is an Intel Cyclone V GX FPGA in a 484-BGA surface-mount package, optimized for industrial applications and high-volume designs. This device combines a mid-density FPGA fabric with on-chip RAM, variable-precision DSP capability, and high-performance transceiver options provided by the Cyclone V family to address industrial, wireless, and wireline use cases.

Key value propositions for this part include a 36,000 logic-element fabric, approximately 1.57 Mbits of embedded memory, flexible I/O (208 pins), and an industrial operating range, all delivered in a compact 484-FBGA (23×23) package.

Key Features

• Logic Capacity  36,000 logic elements provide programmable fabric for custom logic, control, and signal-processing functions.
• Embedded Memory  Approximately 1.57 Mbits of on-chip RAM for buffering, lookup tables, and local data storage.
• DSP and Fabric  Cyclone V family architecture includes variable-precision DSP blocks and an enhanced 8-input adaptive logic module for efficient arithmetic and signal processing.
• I/O and Packaging  208 general-purpose I/O pins in a 484-BGA (supplier package: 484-FBGA 23×23) surface-mount package for compact board-level integration.
• Power and Core Voltage  Designed for a core supply in the 1.07 V to 1.13 V range (nominal 1.1 V core voltage reported for the family) to support low-power operation.
• Operating Range and Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C.
• Family-level Serial Transceiver and IP  The Cyclone V family includes high-speed transceiver and hard IP building blocks (as documented for Cyclone V devices), enabling integration of serial links and memory controllers where required by the design.
• Standards and Compliance  RoHS-compliant manufacture for regulatory and environmental compatibility.

Typical Applications

• Industrial Control  Motor control, PLC logic, and factory-automation interfaces that benefit from programmable logic, local memory, and extended temperature range.
• Wireless Infrastructure  Baseband assist, protocol offload, and FPGA-accelerated signal processing within wireless systems leveraging family transceiver and DSP capabilities.
• Wireline and Networking  Packet processing, interface bridging, and protocol handling in wireline equipment using the device’s programmable fabric and I/O density.

Unique Advantages

• Balanced Logic and Memory:  36,000 logic elements paired with approximately 1.57 Mbits of embedded RAM support mixed control and data-path functions on a single device.
• Industrial Temperature Rating:  Operation from −40 °C to 100 °C makes the device suitable for industrial deployments where environmental range matters.
• Compact, Board-Friendly Package:  484-FBGA (23×23) surface-mount package provides high I/O density in a compact footprint for space-constrained designs.
• Controlled Core Voltage:  Narrow core supply window (1.07 V–1.13 V) simplifies power-rail design for predictable device behavior.
• Family-level IP and Transceiver Options:  Cyclone V GX family architecture includes DSP blocks, hard memory controllers, and serial transceiver capabilities to accelerate system integration.
• Regulatory Compatibility:  RoHS compliance supports environmentally conscious product development and supply requirements.

Why Choose 5CGXFC3B6F23I7?

The 5CGXFC3B6F23I7 delivers a practical balance of programmable logic, embedded memory, and I/O density in an industrial-grade Cyclone V GX package. Its 36,000 logic elements and on-chip RAM enable designers to consolidate control, signal processing, and interface tasks into a single FPGA, reducing board complexity and component count.

This device is well suited for engineering teams developing industrial automation, wireless infrastructure, or wireline networking equipment that require reliable operation across an extended temperature range, deterministic core-voltage requirements, and a compact BGA footprint for high-density PCB layouts.

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