5CGXFC3B6U15A7N

The 5CGXFC3B6U15A7N is an Intel Cyclone V GX field-programmable gate array supplied in a 324-ball LFBGA package (324-UBGA, 15×15). It combines FPGA fabric with features from the Cyclone V family—including integrated transceivers and hard memory controllers—targeting high-bandwidth, cost-sensitive embedded designs in markets such as industrial, wireless and wireline, military, and automotive.

This device is provided as an automotive-grade, AEC‑Q100 qualified part with a core supply range centered around 1.1 V (1.07 V to 1.13 V) and an extended operating temperature range from -40 °C to 125 °C for demanding environments.

Key Features

• Logic Capacity — 31,500 logic elements to implement mid-density FPGA designs.
• Embedded Memory — Approximately 1.38 Mbits of on-chip RAM (1,381,376 bits) for local buffering and state storage.
• I/O — 144 user I/Os to support diverse external interfaces and board-level connectivity.
• Package — 324-LFBGA package (supplier package: 324-UBGA, 15×15) for compact board integration.
• Automotive Qualification — Grade: Automotive with AEC‑Q100 qualification, suitable for automotive electronic systems that require that level of qualification.
• Voltage and Power — Core supply operation in the 1.07 V to 1.13 V range (nominal 1.1 V), consistent with Cyclone V low-power design.
• Temperature Range — Operating range from -40 °C to 125 °C for extended-environment deployment.
• Cyclone V Family Advantages — Built on TSMC 28‑nm low-power (28LP) process technology and includes family-level features such as integrated transceivers and hard memory controllers.
• Standards Compliance — RoHS-compliant for environmental regulatory requirements.

Typical Applications

• Automotive Systems — Use in electronic control units and vehicle subsystems where AEC‑Q100 qualification and extended temperature operation are required.
• Industrial Automation — Motor control, sensor aggregation, and protocol bridging that benefit from on-chip memory and a dense I/O complement.
• Wireless and Wireline Infrastructure — Mid-density datapath processing and interface bridging using integrated transceivers and hard memory controller support.
• Military and Rugged Electronics — Embedded designs requiring qualified components and wide operating temperature ranges for harsh environments.

Unique Advantages

• Automotive-grade qualification: AEC‑Q100 qualification provides a verified pedigree for vehicle electronic systems and related applications.
• Balanced integration: 31,500 logic elements with approximately 1.38 Mbits of embedded RAM and 144 I/Os reduce external component count and simplify board design.
• Compact footprint: 324-LFBGA (15×15) packaging enables dense, space-conscious PCB layouts.
• Robust thermal and voltage envelope: Operation from -40 °C to 125 °C and a defined 1.07–1.13 V supply window supports stable deployment in challenging environments.
• Family-level IP and process: Leverages Cyclone V family features and TSMC 28‑nm low-power process technology for power-aware designs and access to Cyclone V ecosystem resources.
• Regulatory readiness: RoHS compliance simplifies environmental compliance across global markets.

Why Choose 5CGXFC3B6U15A7N?

This Cyclone V GX FPGA strikes a balance between mid-range logic capacity, on-chip memory, and I/O density in a compact 324-LFBGA package. Its AEC‑Q100 automotive qualification and extended temperature rating make it well suited to applications that demand component-level qualification and environmental resilience while leveraging Cyclone V family features such as low-power 28‑nm process advantages and integrated high-speed interfaces.

Designers looking for a qualified, compact FPGA solution for automotive, industrial, wireless/wireline, or military applications will find this part appropriate for control, interfacing, and data-path tasks where a mid-density programmable fabric with embedded memory and moderate I/O is required.

Request a quote or submit an inquiry for pricing and availability to evaluate 5CGXFC3B6U15A7N for your next design.