5CGXFC3B6U19A7N

IC FPGA 208 I/O 484UBGA
Part Description

Cyclone® V GX Field Programmable Gate Array (FPGA) IC 208 1381376 31500 484-FBGA

Quantity 89 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case484-FBGANumber of I/O208Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11900Number of Logic Elements/Cells31500
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits1381376

Overview of 5CGXFC3B6U19A7N – Cyclone V GX FPGA, 31,500 logic elements

The 5CGXFC3B6U19A7N is an Intel Cyclone V GX field-programmable gate array (FPGA) in a 484‑FBGA package. It provides a mid-density FPGA fabric with on-chip memory and I/O resources targeted at systems that require integration of logic, memory, and high-speed interfaces.

Built on the Cyclone V family architecture, the device combines low-voltage operation and integrated system features from the Cyclone V series to address applications across automotive, industrial, wireless/wireline and military markets. It is offered as an automotive‑grade, AEC‑Q100 qualified device with an extended operating range for deployment in demanding environments.

Key Features

  • Logic Fabric — 31,500 logic elements (LEs) for implementing control, signal processing, and custom logic functions within a compact FPGA footprint.
  • Adaptive Logic Modules (ALMs) — Cyclone V family ALM architecture (enhanced 8‑input ALMs with multiple registers) for flexible logic packing and efficient resource utilization.
  • Embedded Memory — Approximately 1.38 Mbits of on-chip RAM for buffering, FIFOs, and local data storage; Cyclone V devices use M10K memory blocks with ECC capability as part of the family feature set.
  • I/O and Package — 208 general-purpose I/O pins in a 484‑FBGA (supplier package: 484‑UBGA, 19×19) surface‑mount package to support multi‑lane interfaces and board-level routing.
  • Power and Voltage — Specified core voltage range of 1.07 V to 1.13 V (nominal 1.1 V core) for predictable power budgeting in system designs.
  • Automotive Qualification — AEC‑Q100 qualification and a graded automotive rating; operating temperature range from −40 °C to 125 °C for extended-environment deployment.
  • Family-Level System Features — Cyclone V family capabilities include integrated transceivers, hard memory controllers, variable‑precision DSP blocks, and optional SoC variants with a hard Arm Cortex‑A9 HPS (as described in the Cyclone V device documentation).
  • Compliance — RoHS‑compliant supply for environmental and manufacturing compatibility.

Typical Applications

  • Automotive Systems — Sensor fusion, gateway and body electronics where an AEC‑Q100 qualified FPGA with extended temperature range and robust I/O is required.
  • Industrial Control — Motor control, machine vision pre‑processing, and deterministic control logic leveraging on‑chip RAM and dense logic resources.
  • Wireless and Wireline Infrastructure — Interface bridging, protocol processing, and buffering using integrated transceivers and hard memory controllers in Cyclone V family architectures.
  • Defense and Aerospace — Ruggedized custom logic and signal-processing functions benefiting from automotive-grade qualification and wide temperature operation.

Unique Advantages

  • Automotive-Ready Qualification: AEC‑Q100 qualification and −40 °C to 125 °C operating range provide design confidence for vehicle-level applications.
  • Balance of Integration and Density: 31,500 logic elements and approximately 1.38 Mbits of embedded RAM deliver a mid-density platform suitable for complex control and signal-processing tasks without excessive board-level components.
  • Predictable Power Envelope: Narrow core voltage range (1.07–1.13 V) simplifies power-supply design and thermal planning.
  • Compact, High‑Pin Package: 484‑FBGA (19×19) package offers 208 I/O in a space-efficient form factor for compact system designs.
  • Family-Level System Features: Access to Cyclone V series capabilities—such as integrated transceivers, hard memory controllers, DSP resources, and SoC HPS options—enables platform scalability and reuse across projects.
  • RoHS Compliance: Environmentally compliant manufacturing and supply chain compatibility.

Why Choose 5CGXFC3B6U19A7N?

The 5CGXFC3B6U19A7N delivers a practical balance of logic density, embedded memory, and I/O capability in an automotive‑qualified Cyclone V GX device. Its combination of mid‑range resources, family-level system features, and a compact 484‑FBGA package make it appropriate for designs that require integration of custom logic, buffering, and high‑speed interfaces within an extended-temperature, AEC‑Q100‑qualified footprint.

Designers targeting automotive, industrial, wireless/wireline or defense applications will find this device useful where a qualified, low-voltage Cyclone V solution is required that aligns with a broader Cyclone V portfolio for migration and scalability.

Request a quote or submit a product inquiry to get pricing and availability for the 5CGXFC3B6U19A7N.

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