5CGXFC3B7F23C8N

The 5CGXFC3B7F23C8N is a Cyclone V GX field‑programmable gate array (FPGA) in a 484‑ball BGA package. It provides approximately 31,500 logic elements, roughly 1.38 Mbits of embedded memory, and 208 I/O pins in a 23 × 23 484‑FBGA footprint for compact, high‑density designs. As a member of the Cyclone V family, this device targets cost‑sensitive commercial applications that require balanced logic capacity, modest embedded memory, and a low core‑voltage architecture.

Key Features

• Logic Capacity  Approximately 31,500 logic elements to implement medium‑complexity FPGA logic and glue‑logic functions.
• Embedded Memory  Approximately 1.38 Mbits of on‑chip RAM for small‑to‑moderate buffering, LUTRAM, and state storage.
• I/O Density  208 general‑purpose I/O pins to support diverse peripheral interfaces and board topologies.
• Package  484‑ball BGA (484‑FBGA, 23 × 23) surface‑mount package for space‑efficient, high‑pin‑count designs.
• Power  Core supply range 1.07 V to 1.13 V (nominally ~1.1 V) consistent with low‑voltage, low‑power Cyclone V device architecture.
• Operating Conditions  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Mounting & Compliance  Surface‑mount device with RoHS compliance for standard commercial production environments.
• Family-level Enhancements  As part of the Cyclone V family, the device benefits from the family’s 28‑nm low‑power process and architecture innovations described in the Cyclone V device documentation.

Typical Applications

• Wireless and Wireline Infrastructure  Suitable for mid‑range protocol processing and interface bridging where Cyclone V family features such as integrated IP blocks and low‑power operation are advantageous.
• Embedded SoC and Processing  Fits designs that combine programmable logic with processor subsystems or hard IP available across the Cyclone V family.
• Commercial Electronics  Well suited for cost‑sensitive commercial products requiring moderate logic capacity, embedded memory, and a compact BGA footprint.
• Prototyping and Custom I/O  Use for board‑level prototyping or applications needing flexible I/O mapping across 208 pins in a compact package.

Unique Advantages

• Balanced Logic and Memory  The combination of ~31,500 logic elements and ~1.38 Mbits of embedded RAM enables versatile mid‑range logic and buffering without excessive device overhead.
• Compact, High‑Pin Package  The 484‑FBGA (23 × 23) package delivers high I/O count in a space‑efficient footprint for dense board designs.
• Low‑Voltage Operation  Core supply specification (1.07–1.13 V) aligns with the Cyclone V family’s low‑power process for reduced power consumption in system designs.
• Commercial Temperature Suitability  Rated for 0 °C to 85 °C operation to meet the environmental range expected in standard commercial deployments.
• RoHS Compliance  RoHS‑compliant part supports regulatory and manufacturing requirements for commercial electronics.

Why Choose 5CGXFC3B7F23C8N?

This Cyclone V GX device delivers a practical balance of programmable logic, embedded memory, and I/O count in a compact 484‑FBGA package, making it a good fit for commercial designs that need mid‑range FPGA capability without unnecessary complexity. Its low core‑voltage operation and family‑level architecture advantages enable efficient power budgeting and straightforward migration across Cyclone V densities.

Designers looking for a cost‑sensitive, commercially graded FPGA with solid logic and I/O resources will find 5CGXFC3B7F23C8N appropriate for embedded processing, interface bridging, and high‑density I/O applications where RoHS compliance and a compact BGA footprint are required.

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