5CGXFC4C6F23C6N

The 5CGXFC4C6F23C6N is a Cyclone® V GX FPGA IC from Intel, delivering a mid-range FPGA fabric with integrated high-speed features suited to bandwidth‑sensitive designs. This device couples a 50,000‑logic‑element fabric with on‑chip embedded memory and integrated transceiver and memory controller capabilities to address industrial, wireless/wireline and military applications.

Designed for surface‑mount applications, the device is offered in a 484‑FBGA (23×23) package, operates at a core voltage window of 1.07 V to 1.13 V, and meets commercial temperature grading (0 °C to 85 °C).

Key Features

• Logic Fabric 50,000 logic elements providing programmable logic capacity for mid‑density FPGA designs.
• Embedded Memory Approximately 2.86 Mbits of on‑chip RAM for buffering, FIFOs, and embedded storage.
• High‑Density I/O 240 user I/O pins to support complex peripheral interfaces and board‑level connectivity.
• High‑Speed Connectivity Integrated transceivers and hard memory controllers to support high bandwidth external interfaces (as described for Cyclone V devices).
• DSP Capability Variable‑precision DSP block support described in Cyclone V documentation for signal processing tasks.
• Power and Voltage Core supply range of 1.07 V to 1.13 V to match typical Cyclone V low‑voltage operation.
• Package and Mounting 484‑FBGA (23×23) package in a surface‑mount form factor for compact board integration.
• Operating Range & Compliance Commercial grade operation from 0 °C to 85 °C and RoHS‑compliant.

Typical Applications

• Industrial Control Implement motor control, robotics interfaces, and factory automation logic using the device’s programmable fabric and extensive I/O.
• Wireless Infrastructure Support PHY and interface functions where integrated transceivers and moderate embedded memory enable packet buffering and protocol handling.
• Wireline & Networking Use the device for network access, aggregation, and interface bridging with high I/O count and hard memory controller support.
• Defense & Military Systems Deploy in commercial‑grade defense subsystems where configurable logic and on‑chip DSP resources are required (meet commercial temperature range).

Unique Advantages

• Balanced Logic and Memory: 50,000 logic elements combined with approximately 2.86 Mbits of embedded RAM provide a flexible platform for control, datapath, and buffering tasks.
• Integrated High‑Speed Interfaces: Built‑in transceivers and hard memory controllers reduce external component count and simplify high‑bandwidth system designs.
• Compact Board Footprint: 484‑FBGA (23×23) packaging in a surface‑mount format supports dense board layouts without sacrificing I/O capacity.
• Low‑Voltage Core: Narrow core voltage range (1.07 V–1.13 V) aligns with low‑power supply designs and simplifies power rail planning.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to match a wide range of commercial and industrial deployments.
• Standards‑Aware Manufacturing: RoHS compliance supports regulatory and environmental requirements for lead‑free production.

Why Choose 5CGXFC4C6F23C6N?

This Cyclone V GX device positions itself as a practical mid‑density FPGA solution for designs that require a balance of programmable logic, embedded memory, and high‑speed interfacing in a compact surface‑mount package. The combination of 50,000 logic elements, ~2.86 Mbits of embedded RAM, integrated transceivers, and a 240‑pin I/O count makes it suitable for industrial controllers, wireless and wireline infrastructure modules, and mission‑critical applications where configurability and I/O density matter.

Backed by Cyclone V family documentation and device-level features, the 5CGXFC4C6F23C6N offers a scalable option for engineers seeking a commercially graded FPGA with integrated connectivity and DSP capabilities, while maintaining RoHS compliance and standard surface‑mount packaging.

Request a quote or submit an inquiry to obtain pricing, availability, and additional ordering information for the 5CGXFC4C6F23C6N Cyclone® V GX FPGA.